Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package includes a first substrate, and a first semiconductor chip positioned above the first substrate. A second semiconductor chip is positioned above a top surface of the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the second semiconductor chip. A second substrate is disposed on the second semiconductor chip. The second substrate substantially covers a top surface of the second semiconductor chip. A mold layer is disposed between the first substrate and the second substrate.

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package includes a first substrate, and a first semiconductor chip positioned above the first substrate. A second semiconductor chip is positioned above a top surface of the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the second semiconductor chip. A second substrate is disposed on the second semiconductor chip. The second substrate substantially covers a top surface of the second semiconductor chip. A mold layer is disposed between the first substrate and the second substrate.

Abstract: A substrate strip is provided. The substrate strip includes a core layer including first and second substrate regions spaced apart from each other and a dummy region between the first and second substrate regions, a first interconnection layer disposed on top surfaces of the first and second substrate regions, a second interconnection layer disposed on bottom surfaces of the first and second substrate regions, and a warpage control member provided on any one of a top surface and a bottom surface of the dummy region. The warpage control member includes a metal.