Patents by Inventor MYOUNGSUB NOH

MYOUNGSUB NOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230215699
    Abstract: According to one aspect of the present invention, a method of treating a substrate within a chamber includes performing a unit cycle at least one time, in which the unit cycle includes a substrate treatment step of supplying a reaction gas in which radicals constituting plasma of a first treatment gas are mixed with a second treatment gas onto the substrate, wherein the substrate includes a first thin film, and a second thin film having a lower reactivity to the reaction gas than the first thin film.
    Type: Application
    Filed: December 12, 2022
    Publication date: July 6, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Myoungsub NOH, Seong Gil LEE, Dong-Hun KIM, Dong Sub OH, Jountaek KOO, Wan Jae PARK
  • Publication number: 20210287877
    Abstract: An apparatus for treating a substrate includes a process chamber having an inner space, a support unit supporting a substrate in the inner space, a processing gas supply unit for supplying a processing gas to the inner space, and a plasma source that excites the processing gas in a plasma state in the inner space. The processing gas supply unit includes a heater that heats the processing gas.
    Type: Application
    Filed: March 15, 2021
    Publication date: September 16, 2021
    Applicant: SEMES CO., LTD.
    Inventors: DONG-HUN KIM, WAN JAE PARK, SEONG GIL LEE, JI-HWAN LEE, YOUNGJE UM, DONG SUB OH, MYOUNGSUB NOH
  • Publication number: 20210151333
    Abstract: A method for processing a substrate includes providing the substrate, a film being formed on the substrate, performing pretreatment to surface-treat the film formed on the substrate using a treatment gas in a plasma state, and performing, after the pretreatment, liquid treatment to remove the film from the substrate by supplying a treatment liquid onto the substrate.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 20, 2021
    Applicant: SEMES CO., LTD.
    Inventors: JI-HWAN LEE, SEONG GIL LEE, DONG SUB OH, MYOUNGSUB NOH, DONG-HUN KIM, WAN JAE PARK