Abstract: A method for severing a workpiece having a transparent material includes providing multiple focus elements using an input laser beam, applying the multiple focus elements to the material, thereby forming material modifications in the material along a predetermined processing line, and severing the material along the processing line by an etching process using a wet chemical solution. A temperature of the wet chemical solution during the etching process is at least 100° C. and/or at most 150° C.

Abstract: A method for laser processing a workpiece is provided. The workpiece includes a transparent material. The method includes splitting an input laser beam into a plurality of partial beams using a beam splitter, focusing the plurality of partial beams coupled out of the beam splitter to form multiple focus elements, and subjecting the material of the workpiece to the multiple focus elements for laser processing. A distance between adjacent focus elements is at least 3 ?m and/or at most 70 ?m.

Abstract: An apparatus for laser machining a workpiece in a machining plane includes a first laser machining unit for forming a first focal zone which extends in a first main direction of extent, and at least one further laser machining unit for forming at least one further focal zone which extends in a further main direction of extent oriented transversely to the first main direction of extent. The first focal zone and the at least one further focal zone are spaced apart from one another parallel to the machining plane at a work distance. The first laser machining unit and the at least one further laser machining unit are movable in an advancement direction that is oriented parallel to the machining plane. The workpiece comprises a material that is transparent to a laser beam which respectively forms the first focal zone and the at least one further focal zone.

Abstract: A method for laser processing a workpiece is provided. The workpiece includes a material transparent to a laser beam of the laser processing. The method includes splitting an input laser beam by using a beam splitter into a plurality of partial beams. The splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam. The method further includes focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams. The method further includes subjecting the material of the workpiece to at least a subset of the multiple focus elements. The application of the phases is performed in such a way that at least two of the multiple focus elements have different intensities.

Abstract: An apparatus for laser machining a workpiece in a machining plane includes a first laser machining unit for forming a first focal zone which extends in a first main direction of extent, and at least one further laser machining unit for forming at least one further focal zone which extends in a further main direction of extent oriented transversely to the first main direction of extent. The first focal zone and the at least one further focal zone are spaced apart from one another parallel to the machining plane at a work distance. The first laser machining unit and the at least one further laser machining unit are movable in an advancement direction that is oriented parallel to the machining plane. The workpiece comprises a material that is transparent to a laser beam which respectively forms the first focal zone and the at least one further focal zone.

Abstract: An apparatus for laser machining a workpiece with a material transparent to the laser machining includes a first beam shaping device with a beam splitting element for splitting a first input beam into a plurality of component beams, and a focusing optical unit configured to image the plurality of component beams into at least one focal zone. The first input beam is split by the beam splitting element by phase imposition on the first input beam. The component beams are focused into different partial regions of the at least one focal zone for forming the at least one focal zone. The at least one focal zone is introduced by the focusing optical unit into the material for laser machining the workpiece. Material modifications associated with a crack formation in the material are produced in the material by exposing the material to the at least one focal zone.

Abstract: An apparatus for laser machining a workpiece includes a first beam shaping device comprising a beam splitting element for splitting a first input beam into a plurality of component beams, and a focusing optical unit configured to image the component beams into at least one focal zone. The first input beam is split by the beam splitting element by phase imposition on the first input beam. The component beams are focused into different partial regions of the at least one focal zone for forming the at least one focal zone. The at least one focal zone is introduced into the material at a work angle with respect to an outer side of the workpiece for the laser machining of the workpiece. Material modifications associated with a change of a refractive index of the material are produced in the material by exposing the material to the at least one focal zone.

Abstract: A method for separating a workpiece having a transparent material includes providing ultrashort laser pulses using an ultrashort pulse laser, introducing material modifications into the transparent material of the workpiece along a separation line, and separating the material of the workpiece along the separation line. The laser pulses form a laser beam that is incident onto the workpiece at a work angle. The material modifications are Type III modifications associated with a formation of cracks in the material of the workpiece. The material modifications penetrate two sides of the workpiece that are located in intersecting planes. Separating the material of the workpiece produces a chamfer and/or a bevel. A length of a hypotenuse of the chamfer and/or bevel is between 50 ?m and 5000 ?m.

Abstract: A method for separating a workpiece having a transparent material includes providing ultrashort laser pulses using an ultrashort pulse laser, introducing material modifications into the transparent material of the workpiece along a separation line using the laser pulses, and separating the material of the workpiece along the separation line. The laser pulses form a laser beam that is incident onto the workpiece at a work angle. The material modifications are Type I and/or Type II modifications associated with a change in a refractive index of the material of the workpiece. The material modifications penetrate two sides of the workpiece that are located in intersecting planes. Separating the material of the workpiece produces a chamfer and/or a bevel. A length of a hypotenuse of the chamfer and/or bevel is between 50 ?m and 500 ?m.

Abstract: For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

Abstract: A method for severing an at least partially transparent material includes focusing ultrashort laser pulses, as individual laser pulses and/or as pulse trains, in the material so that a resulting modification zone elongated in a beam propagation direction enters the material and penetrates at least one surface of the material. Each pulse train comprises multiple sub-laser pulses, The method further includes introducing a plurality of material modifications along a severing line into the material via the laser pulses, and severing the material along the severing line, A pulse energy of the individual laser pulses or a sum of pulse energies of the sub-laser pulses is in a range from 500 ?J to 50 mJ. A length of the modification zone in the beam propagation direction is greater than a thickness of the material.

Abstract: A method for separating an ultrathin glass using ultrashort laser pulses of an ultrashort pulse laser includes focusing the ultrashort laser pulses into the ultrathin glass such that a resulting focal zone is elongated in a beam direction and extends over an entire thickness of the ultrathin glass. The ultrashort laser pulses have a non-radially symmetric beam cross section perpendicular to a beam propagation direction. The method further includes introducing material modifications into the ultrathin glass along a separating line using the ultrashort laser pulses focused into the ultrathin glass, and separating the ultrathin glass along the separating line.

Abstract: A method for selective laser-induced etching of a microhole into a workpiece includes creating a modification in the workpiece that extends from an entrance side to an exit side of the workpiece. The modification is created by a laser pulse that has an annular transverse intensity distribution. The modification delimites a cylindrical body from a residual material surrounding the modification. The method further includes introducing the workpiece with the modification into a wet-chemical etching bath for structurally separating the cylindrical body from the residual material.

Abstract: The present invention relates to a method for machining a workpiece, comprising the steps of introducing a plurality of adjacent modifications into the material of the workpiece by means of laser radiation, etching the material of the workpiece in a first etching operation with a first selectivity, in order to remove predominantly the material modified by the laser radiation, and, after completion of the first etching operation, etching the material of the workpiece in a second etching operation with a second selectivity, different from the first selectivity, in order to remove the webs left between the removed modified material.

Abstract: For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

Abstract: For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

Abstract: An optical system for shaping a laser beam includes a beam shaping element configured to receive the laser beam having a transverse input intensity profile and to impose a beam shaping phase distribution onto the laser beam. The optical system further includes a near field optical element, arranged downstream of the beam shaping element at a beam shaping distance and is configured to focus the laser beam into the focus zone. The imposed phase distribution results in a virtual optical image of the elongated focus zone located before the beam shaping element. The beam shaping distance corresponds to a propagation length of the laser beam within which the imposed phase distribution transforms the transverse input intensity profile into a transverse output intensity profile at the near field optical element.

Abstract: An optical system for shaping a laser beam includes a beam shaping element configured to receive the laser beam having a transverse input intensity profile and to impose a beam shaping phase distribution onto the laser beam. The optical system further includes a near field optical element, arranged downstream of the beam shaping element at a beam shaping distance and is configured to focus the laser beam into the focus zone. The imposed phase distribution results in a virtual optical image of the elongated focus zone located before the beam shaping element. The beam shaping distance corresponds to a propagation length of the laser beam within which the imposed phase distribution transforms the transverse input intensity profile into a transverse output intensity profile at the near field optical element.

Abstract: An optical system for shaping a laser beam includes a beam shaping element configured to receive the laser beam having a transverse input intensity profile and to impose a beam shaping phase distribution onto the laser beam. The optical system further includes a near field optical element, arranged downstream of the beam shaping element at a beam shaping distance and is configured to focus the laser beam into the focus zone. The imposed phase distribution results in a virtual optical image of the elongated focus zone located before the beam shaping element. The beam shaping distance corresponds to a propagation length of the laser beam within which the imposed phase distribution transforms the transverse input intensity profile into a transverse output intensity profile at the near field optical element.

Abstract: For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.