Patents by Inventor Myron H. GENTRUP
Myron H. GENTRUP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10249330Abstract: An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. One test element is coupled to a group of leads of the connector. All positive polarity leads of the group of leads are coupled together on the substrate, and all negative polarity leads of the group of leads are coupled together on the substrate, such that the test element is coupled across the positive and the negative coupled leads of the group of leads of the connector. The test element is coupled across pairs of leads of the cable when the cable is coupled to the connector. Additional systems and methods are also presented.Type: GrantFiled: February 10, 2015Date of Patent: April 2, 2019Assignee: International Business Machines CorporationInventors: Myron H. Gentrup, Icko E. T. Iben, John T. Kinnear, Jr.
-
Patent number: 10080278Abstract: Embodiments of the invention relate to electrostatic discharge (ESD) protection. One embodiment includes creating a window for multiple leads in a first plane on a cable. A common bus bar is attached adjacent to the window in a second plane on the cable. A first dissipative adhesive (DA) is applied across at least a portion of the multiple leads to connect the multiple leads to one another and to the common bus bar. At least some leads of the multiple leads are operatively connected to an element of an electronic device.Type: GrantFiled: September 30, 2015Date of Patent: September 18, 2018Assignee: International Business Machines CorporationInventors: Robert G. Biskeborn, Myron H. Gentrup, Icko E. T. Iben, Ho-Yiu Lam
-
Patent number: 9668339Abstract: A first dissipative adhesive (DA) is connected to at least a portion of leads that are exposed in a first plane of a flexible cable in a coverage area. A second DA is connected over at least a portion of the first DA. A third DA is connected to a ground and over a fourth DA. A servo connection is electrically connected to a grounding tab via the third DA. A common bus bar is connected to the portion of the leads via the second DA.Type: GrantFiled: August 17, 2016Date of Patent: May 30, 2017Assignee: International Business Machines CorporationInventors: Robert G. Biskeborn, Myron H. Gentrup, Icko E. T. Iben, Ho-Yiu Lam
-
Publication number: 20160360608Abstract: A first dissipative adhesive (DA) is connected to at least a portion of leads that are exposed in a first plane of a flexible cable in a coverage area. A second DA is connected over at least a portion of the first DA. A third DA is connected to a ground and over a fourth DA. A servo connection is electrically connected to a grounding tab via the third DA. A common bus bar is connected to the portion of the leads via the second DA.Type: ApplicationFiled: August 17, 2016Publication date: December 8, 2016Inventors: Robert G. Biskeborn, Myron H. Gentrup, Icko E.T. Iben, Ho-Yiu Lam
-
Patent number: 9472949Abstract: Embodiments of the invention relate to electrostatic discharge (ESD) protection. One embodiment includes a first dissipative adhesive (DA) connected to at least a portion of multiple leads in a first plane of a flexible cable in a coverage area for providing ESD protection to at least one element of an electronic device. A common bus bar is connected to the leads in a second plane of the flexible cable. Conductivity of the common bus bar is greater than conductivity of the first DA and the first plane and the second plane are different planes of the flexible cable.Type: GrantFiled: May 24, 2013Date of Patent: October 18, 2016Assignee: International Business Machines CorporationInventors: Robert G. Biskeborn, Myron H. Gentrup, Icko E. T. Iben, Ho-Yiu Lam
-
Publication number: 20160028228Abstract: Embodiments of the invention relate to electrostatic discharge (ESD) protection. One embodiment includes creating a window for multiple leads in a first plane on a cable. A common bus bar is attached adjacent to the window in a second plane on the cable. A first dissipative adhesive (DA) is applied across at least a portion of the multiple leads to connect the multiple leads to one another and to the common bus bar. At least some leads of the multiple leads are operatively connected to an element of an electronic device.Type: ApplicationFiled: September 30, 2015Publication date: January 28, 2016Inventors: Robert G. Biskeborn, Myron H. Gentrup, Icko E.T. Iben, Ho-Yiu Lam
-
Patent number: 9202486Abstract: In one embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.Type: GrantFiled: January 10, 2014Date of Patent: December 1, 2015Assignee: GLOBALFOUNDRIES Inc.Inventors: Dylan J. Boday, Myron H. Gentrup, Icko E. T. Iben
-
Publication number: 20150154993Abstract: An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. One test element is coupled to a group of leads of the connector. All positive polarity leads of the group of leads are coupled together on the substrate, and all negative polarity leads of the group of leads are coupled together on the substrate, such that the test element is coupled across the positive and the negative coupled leads of the group of leads of the connector. The test element is coupled across pairs of leads of the cable when the cable is coupled to the connector. Additional systems and methods are also presented.Type: ApplicationFiled: February 10, 2015Publication date: June 4, 2015Inventors: Myron H. Gentrup, Icko E.T. Iben, John T. Kinnear, JR.
-
Patent number: 8970239Abstract: An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. Additional systems and methods are also presented.Type: GrantFiled: September 27, 2010Date of Patent: March 3, 2015Assignee: International Business Machines CorporationInventors: Myron H. Gentrup, Icko E. T. Iben, John T. Kinnear, Jr.
-
Publication number: 20140347766Abstract: Embodiments of the invention relate to electrostatic discharge (ESD) protection. One embodiment includes a first dissipative adhesive (DA) connected to at least a portion of multiple leads in a first plane of a flexible cable in a coverage area for providing ESD protection to at least one element of an electronic device. A common bus bar is connected to the leads in a second plane of the flexible cable. Conductivity of the common bus bar is greater than conductivity of the first DA and the first plane and the second plane are different planes of the flexible cable.Type: ApplicationFiled: May 24, 2013Publication date: November 27, 2014Inventors: Robert G. Biskeborn, Myron H. Gentrup, Icko E.T. Iben, Ho-Yiu Lam
-
Publication number: 20140127396Abstract: In one embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.Type: ApplicationFiled: January 10, 2014Publication date: May 8, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Myron H. Gentrup, Icko E.T. Iben
-
Patent number: 8673462Abstract: A system, in one embodiment, includes an ESD adhesive operatively coupled to leads of an electronic device for providing ESD protection thereto, the ESD adhesive including a mixture of a polymeric thin film and electrically conductive fillers dispersed in the polymeric thin film, and has a structural characteristic of being formed through at least partial evaporation of a solvent therefrom and being substantially free of agglomerates of the electrically conductive fillers. In another embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.Type: GrantFiled: September 2, 2011Date of Patent: March 18, 2014Assignee: International Business Machines CorporationInventors: Dylan J. Boday, Myron H. Gentrup, Icko E. T. Iben
-
Publication number: 20130057999Abstract: A system, in one embodiment, includes an ESD adhesive operatively coupled to leads of an electronic device for providing ESD protection thereto, the ESD adhesive including a mixture of a polymeric thin film and electrically conductive fillers dispersed in the polymeric thin film, and has a structural characteristic of being formed through at least partial evaporation of a solvent therefrom and being substantially free of agglomerates of the electrically conductive fillers. In another embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.Type: ApplicationFiled: September 2, 2011Publication date: March 7, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Myron H. Gentrup, Icko E. T. Iben
-
Publication number: 20120074978Abstract: An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. Additional systems and methods are also presented.Type: ApplicationFiled: September 27, 2010Publication date: March 29, 2012Applicant: International Business Machines CorporationInventors: Myron H. GENTRUP, Icko E.T. IBEN, John T. KINNEAR, JR.