Patents by Inventor Myron Lemecha
Myron Lemecha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6655504Abstract: A braking unit is provided. In one embodiment, the braking unit comprises a base member, a guide member, a flexible rod, an actuator adapted to induce deformation of the rod, and a brake pad. One end of the flexible rod is fixedly attached to the base member while another end is slideably disposed within a passageway defined by the guide member. The brake pad is positioned adjacent the flexible rod such that deformation of the rod causes lateral movement of the brake pad. The braking unit can be incorporated into disc and drum-type braking assemblies and systems.Type: GrantFiled: July 12, 2001Date of Patent: December 2, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Patent number: 6571820Abstract: A vent assembly that can be concealed when in a closed configuration is provided in one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent. A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.Type: GrantFiled: July 12, 2001Date of Patent: June 3, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Patent number: 6555015Abstract: Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.Type: GrantFiled: November 9, 2000Date of Patent: April 29, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Daniel Phillip Dailey, Robert Edward Belke, Jr., Jay DeAvis Baker, Achyuta Achari, Myron Lemecha, Michael George Todd
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Publication number: 20030074957Abstract: An integrated engine combustion monitoring system that includes at least one structure comprising a light communication channel (LCC) and a sensor, which are embedded in a cylinder head gasket, for monitoring combustion composition, pressure, or temperature. The sensor and the LCC may be positioned between an air cavity or a material comprising a photorefractive gel or polymer. The sensor includes a sensing component that may have various shapes or configurations. The LCC comprises one or more materials, such as a polymer, which may be formed into a strand or other structural shape and incorporated into the cylinder head gasket. The other end of the LCC may be fabricated as part of one or more engine structures or it may be connected to other structures or components such as optical detectors or associated process control electronics.Type: ApplicationFiled: August 28, 2002Publication date: April 24, 2003Applicant: Visteon Global Technologies, Inc.Inventors: Myron Lemecha, Jay Baker, Achyuta Achari, William D. Hopfe, Lakhi N. Goenka
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Patent number: 6547117Abstract: A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.Type: GrantFiled: July 12, 2001Date of Patent: April 15, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Patent number: 6528736Abstract: Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.Type: GrantFiled: January 21, 1997Date of Patent: March 4, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Daniel Phillip Dailey, Robert Edward Belke, Jr., Jay DeAvis Baker, Achyuta Achari, Myron Lemecha, Michael George Todd
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Patent number: 6501031Abstract: A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.Type: GrantFiled: September 6, 2000Date of Patent: December 31, 2002Assignee: Visteon Global Tech., Inc.Inventors: Andrew Z. Glovatsky, Jay D. Baker, Robert Edward Belke, Myron Lemecha, Richard Keith McMillan, Thomas B. Krautheim
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Publication number: 20020144802Abstract: A container defines an annular chamber that is partially filled with a liquid coolant. The container is capable of receiving a cooling conduit in which forced air or liquid flows. Heat generated by an electronic device is transferred to the liquid coolant within the container and causes the liquid coolant to boil. The vaporized coolant rises away from the electronic device carrying the latent heat of vaporization. The vaporized coolant condenses on and near surfaces within the container cooled by the cooling conduit and the heat is transferred to the air or liquid within the cooling conduit. The condensed coolant travels back toward the electronic device via gravity and/or a wick structure.Type: ApplicationFiled: April 6, 2001Publication date: October 10, 2002Applicant: VISTEON GLOBAL TECHNOLOGIESInventors: Vivek Amir Jairazbhoy, Prathap Amervai Reddy, Jay D. Baker, Lawrence LeRoy Kneisel, Myron Lemecha
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Patent number: 6408811Abstract: Conductors supported integrally with engine structure such as air intake manifolds and the like provide interconnection between engine components without the need for separate conventional wiring harnesses. The conductors take their mechanical strength from the underlying physical object and thus can be lighter than a freestanding harness. Connectors allow traces to continue across points of mechanical interface between structural components and allow wiring of engine components to be accomplished in the same operation as their physical assembly.Type: GrantFiled: April 18, 2000Date of Patent: June 25, 2002Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Zachary Glovatsky, Jay DeAvis Baker, Myron Lemecha
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Publication number: 20020043434Abstract: A braking unit is provided. In one embodiment, the braking unit comprises a base member, a guide member, a flexible rod, an actuator adapted to induce deformation of the rod, and a brake pad. One end of the flexible rod is fixedly attached to the base member while another end is slideably disposed within a passageway defined by the guide member. The brake pad is positioned adjacent the flexible rod such that deformation of the rod causes lateral movement of the brake pad.Type: ApplicationFiled: July 12, 2001Publication date: April 18, 2002Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Publication number: 20020015243Abstract: A flexible mirror assembly is provided. The mirror assembly includes a mold line structure unit having a flexible mirror surface secured to a flexible panel. An actuator induces deformation of the flexible mirror surface such that it alters an angle at which the mirror surface reflects light.Type: ApplicationFiled: July 12, 2001Publication date: February 7, 2002Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Publication number: 20020008127Abstract: A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.Type: ApplicationFiled: July 12, 2001Publication date: January 24, 2002Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Publication number: 20020008231Abstract: A vehicle jack adapted to be mounted to a vehicle chassis is provided. In one embodiment, the jack comprises a base member, a guide member, a flexible rod, and an actuator. One end of the rod is fixedly attached to the base member while a second end is slideably disposed within a passageway defined by the guide member. The actuator forces the flexible rod to deform by causing the second end of the rod to move with respect to the passageway. When mounted to a vehicle chassis, the jack is operated by deforming the flexible rod until a support surface, such as the ground, is encountered, and subsequently continuing to deform the rod until the vehicle becomes elevated. A vehicle jacking system incorporating the jacks of the invention is also provided.Type: ApplicationFiled: July 12, 2001Publication date: January 24, 2002Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Publication number: 20020007852Abstract: A vent assembly that can be concealed when in a closed configuration is provided In one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.Type: ApplicationFiled: July 12, 2001Publication date: January 24, 2002Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Patent number: 6320128Abstract: An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly.Type: GrantFiled: May 25, 2000Date of Patent: November 20, 2001Assignee: Visteon Global Technology, Inc.Inventors: Andrew Zachary Glovatsky, Brenda Joyce Nation, Charles Frederick Schweitzer, Daniel Phillip Dailey, Delin Li, Jay DeAvis Baker, Lakhi Nandlal Goenka, Lawrence LeRoy Kneisel, Myron Lemecha
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Patent number: 6284998Abstract: There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.Type: GrantFiled: December 1, 1999Date of Patent: September 4, 2001Assignee: Visteon Global Technologies, Inc.Inventors: Peter Joseph Sinkunas, Andrew Zachary Glovatsky, Bernard Allen Meyer, Zhong-You Joe Shi, Myron Lemecha, Rexanne M. Coyner
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Patent number: 6279527Abstract: There is disclosed herein an apparatus for routing electrical signals in an engine having n cylinders and an intake manifold, one embodiment of which comprises: (1) a generally rigid housing generally conforming in shape with and being removably attachable to a top surface of the intake manifold; (2) at least n carrier members attached to the housing and extending outward therefrom, wherein each carrier member is arranged in general proximity with a respective cylinder; (3) a plurality of conductive circuit traces arranged on or within an underside or other surface of the housing and on or within each carrier member; and (4) at least one input/output connector for connection to at least one of an external signal source, an external power source, an external signal destination, and an external power destination, wherein each input/output connector is attached to the housing and is electrically connected to at least one of the circuit traces.Type: GrantFiled: October 17, 2000Date of Patent: August 28, 2001Assignee: Visteon Global Tech., Inc.Inventors: Andrew Z. Glovatsky, Myron Lemecha, Mark Miller, Jay DeAvis Baker
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Patent number: 6186106Abstract: There is disclosed herein an apparatus for routing electrical signals in an engine having n cylinders and an intake manifold, one embodiment of which comprises: (1) a generally rigid housing generally conforming in shape with and being removably attachable to a top surface of the intake manifold; (2) at least n carrier members attached to the housing and extending outward therefrom, wherein each carrier member is arranged in general proximity with a respective cylinder; (3) a plurality of conductive circuit traces arranged on or within an underside or other surface of the housing and on or within each carrier member; and (4) at least one input/output connector for connection to at least one of an external signal source, an external power source, an external signal destination, and an external power destination, wherein each input/output connector is attached to the housing and is electrically connected to at least one of the circuit traces.Type: GrantFiled: December 29, 1997Date of Patent: February 13, 2001Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Z. Glovatsky, Myron Lemecha, Mark Miller, Jay DeAvis Baker
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Patent number: 6053148Abstract: There is disclosed herein an intake manifold for a port-injected internal combustion engine, comprising: a manifold body 10 having an interior plenum 12, and a runner 14 extending outward from the manifold body 10, wherein the runner 14 has a distal end 16 and a passage 18 therethrough in communication with the plenum 12. The distal end 16 of the runner 14 has a socket 20 therein into which an EFI 50 may be operatively mounted, and a first keying feature 22 formed therein for aligning the EFI in a first predetermined orientation when the EFI is engaged with the socket 20 and keying feature 22. The manifold may further include a second keying feature 42 formed in the runner end 16 for aligning a coil-on-plug spark plug ignition coil 80 in a second predetermined orientation when the coil 80 is engaged with the second keying feature 42.Type: GrantFiled: February 21, 1998Date of Patent: April 25, 2000Assignee: Ford Motor CompanyInventors: Andrew Zachary Glovatsky, Jay DeAvis Baker, Myron Lemecha, Mark Miller
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Patent number: 5996222Abstract: A soldering process is suitable for use with low cost, low heat distortion temperature thermoplastic substrates without distortion or damage to the substrate yet having the mass production capability exhibited by wave and reflow soldering techniques. The process allows integration of consumer products and, in particular, vehicle components such as integrated instrument panel or other such assemblies, without the redundancy of separate printed circuit boards.Type: GrantFiled: May 26, 1998Date of Patent: December 7, 1999Assignee: Ford Motor CompanyInventors: Dongkai Shangguan, Myron Lemecha, Achyuta Achari