Abstract: A semiconductor device has a semiconductor die (12) mounted to a leadframe (25). The semiconductor die is a power semiconductor device. A thermally conductive overmolding compound (22) is formed over the semiconductor die. The overmolding compound is made with a thermally conductive epoxy that conducts heat in the range of 2-5 watts/meter K. A pin-fin heat sink (24) is mounted to a top surface of the thermally conductive overmolding compound. The heat sink has a solid base (28) with a plurality of pin-fins (30) extending from the base. Scour lines (40) are cut in the base between the pin-fins. The heat generated by the semiconductor die is dissipated through the thermally conductive overmolding compound to the pin-fin heat sink.

Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.