Patents by Inventor Myun-Kyu Park

Myun-Kyu Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resist stripping solution composition, and method for stripping resist by using same
    Patent number: 9081291
    Abstract: Disclosed is a resist stripping solution composition, which is highly capable of removing a resist pattern and an etching residue after dry etching or wet etching, manifests excellent anticorrosive effects on metal wiring including aluminum and/or copper because a predetermined polyol compound is used, and also can process a number of substrates because a predetermined amide compound is used, thus greatly contributing to reducing the cost. A method of stripping a resist using the resist stripping solution composition is also provided.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: July 14, 2015
    Assignee: Dongwoo Fine-Chem Co., Ltd.
    Inventors: Myun-Kyu Park, Tae-Hee Kim, Jeong-Hyun Kim, Seung-Yong Lee, Byoung-Mook Kim
  • RESIST STRIPPING SOLUTION COMPOSITION, AND METHOD FOR STRIPPING RESIST BY USING SAME
    Publication number: 20120181248
    Abstract: Disclosed is a resist stripping solution composition, which is highly capable of removing a resist pattern and an etching residue after dry etching or wet etching, manifests excellent anticorrosive effects on metal wiring including aluminum and/or copper because a predetermined polyol compound is used, and also can process a number of substrates because a predetermined amide compound is used, thus greatly contributing to reducing the cost. A method of stripping a resist using the resist stripping solution composition is also provided.
    Type: Application
    Filed: August 10, 2010
    Publication date: July 19, 2012
    Applicant: Dongwoo Fine-Chem Co., Ltd.
    Inventors: Myun-Kyu Park, Tae-Hee Kim, Jeong-Hyun Kim, Seung-yong Lee, Byoung-Mook Kim
  • Composition for removing an insulation material and related methods
    Patent number: 7842623
    Abstract: A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: November 30, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chun-Deuk Lee, Jung-Jea Myung, Myun-Kyu Park, Dong-Min Kang, Byoung-Woo Son, Masayuki Takashima, Young-Nam Kim, Hyun-Joon Kim
  • COMPOSITION FOR REMOVING AN INSULATION MATERIAL AND RELATED METHODS
    Publication number: 20090305931
    Abstract: A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 10, 2009
    Applicants: SAMSUNG ELECTRONICS CO., LTD., DONGWOO FINE-CHEM CO., LTD.
    Inventors: Chun-Deuk LEE, Jung-Jea MYUNG, Myun-Kyu PARK, Dong-Min KANG, Byoung-Woo SON, Masayuki TAKASHIMA, Young-Nam KIM, Hyun-Joon KIM
  • Composition for removing an insulation material and related methods
    Patent number: 7566666
    Abstract: A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: July 28, 2009
    Assignees: Samsung Electronics Co., Ltd., Dongwoo Fine-Chem Co., Ltd.
    Inventors: Chun-Deuk Lee, Jung-Jea Myung, Myun-Kyu Park, Dong-Min Kang, Byoung-Woo Son, Masayuki Takashima, Young-Nam Kim, Hyun-Joon Kim
  • Composition for removing an insulation material and related methods
    Publication number: 20070082497
    Abstract: A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
    Type: Application
    Filed: August 8, 2006
    Publication date: April 12, 2007
    Inventors: Chun-Deuk Lee, Jung-Jea Myung, Myun-Kyu Park, Dong-Min Kang, Byoung-Woo Son, Masayuki Takashima, Young-Nam Kim, Hyun-Joon Kim