Patents by Inventor Myun-sung Kang

Myun-sung Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages
    Patent number: 8901727
    Abstract: A semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a third semiconductor chip on the second semiconductor chip and a fourth semiconductor chip on the third semiconductor chip. A first underfill layer is positioned between the second semiconductor chip and the first semiconductor chip; a second underfill layer is positioned between the third semiconductor chip and the second semiconductor chip, and a third underfill layer is positioned between the fourth semiconductor chip and the third semiconductor chip. In some embodiments, the second underfill layer comprises a material that is different than the first and third underfill layers.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: December 2, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myun-sung Kang, Jung-min Ko, Sang-sick Park, Won-keun Kim, Ji-seok Hong
  • SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES, AND SYSTEMS INCLUDING SEMICONDUCTOR PACKAGES
    Publication number: 20140084456
    Abstract: A semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a third semiconductor chip on the second semiconductor chip and a fourth semiconductor chip on the third semiconductor chip. A first underfill layer is positioned between the second semiconductor chip and the first semiconductor chip; a second underfill layer is positioned between the third semiconductor chip and the second semiconductor chip, and a third underfill layer is positioned between the fourth semiconductor chip and the third semiconductor chip. In some embodiments, the second underfill layer comprises a material that is different than the first and third underfill layers.
    Type: Application
    Filed: February 22, 2013
    Publication date: March 27, 2014
    Inventors: Myun-sung Kang, Jung-min Ko, Sang-sick Park, Won-keun Kim, Ji-seok Hong