Patents by Inventor Myung Chan Son
Myung Chan Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145167Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes and external electrodes disposed on an external surface of the body and connected to the internal electrodes. The body includes a first surface and a second surface to which the internal electrodes are exposed, the first surface and the second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction which is a direction in which the dielectric layers are stacked, and a fifth surface and a sixth surface opposing each other in a third direction. At least one of the internal electrodes include a first bottleneck structure having a first directional length of a third-directional outer region smaller than an inner region thereof and a second bottleneck structure having a third directional length of a first directional outer region smaller than an inner region thereof.Type: ApplicationFiled: January 10, 2024Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Myung Chan Son, Sim Chung Kang, Eun Jin Shim, Sun Hwa Kim, Byung Soo Kim
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Publication number: 20240071689Abstract: A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.Type: ApplicationFiled: March 28, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Chan SON, Yong PARK, Jong Ho LEE, Eun Jung LEE, Jung Tae PARK, Min Woo KIM, Ji Hyeon LEE, Sun Mi KIM
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Patent number: 11911749Abstract: Provided are a chromium catalyst precursor, an ethylene oligomerization catalyst including the same, and a method of preparing an ethylene oligomer using the same. More particularly, a chromium catalyst precursor which may oligomerize ethylene with high activity and high selectivity in spite of not using methylaluminoxane (MAO) or modified-methylaluminoxane (MMAO), an oligomerization catalyst including the same, and a method of preparing an ethylene oligomer using the same are provided.Type: GrantFiled: August 18, 2022Date of Patent: February 27, 2024Assignee: SK Innovation Co., Ltd.Inventors: Il Gu Jung, Hyo Seung Park, Jun Soo Son, Myung Jin Kim, Jong Chan Kim
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Patent number: 11908623Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes and external electrodes disposed on an external surface of the body and connected to the internal electrodes. The body includes a first surface and a second surface to which the internal electrodes are exposed, the first surface and the second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction which is a direction in which the dielectric layers are stacked, and a fifth surface and a sixth surface opposing each other in a third direction. At least one of the internal electrodes include a first bottleneck structure having a first directional length of a third-directional outer region smaller than an inner region thereof and a second bottleneck structure having a third directional length of a first directional outer region smaller than an inner region thereof.Type: GrantFiled: March 18, 2021Date of Patent: February 20, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Myung Chan Son, Sim Chung Kang, Eun Jin Shim, Sun Hwa Kim, Byung Soo Kim
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Patent number: 11557438Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, and further including a plurality of internal electrodes having a dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the body and connected to the internal electrodes. The body further includes an active portion in which the plurality of internal electrodes are located to form capacitance and a side margin portion covering a first surface and a second surface of the active portion opposing each other. An average grain size of a dielectric layer included in the active portion is different from an average grain size of a dielectric layer included in the margin portion. The side margin portion includes an extending portion extending between the external electrodes and the internal electrodes to cover a portion of the internal electrodes.Type: GrantFiled: April 5, 2021Date of Patent: January 17, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Chang Ho Seo, Eun Jung Lee, Myung Chan Son, Jung Tae Park, Chang Soo Park, Min Woo Kim
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Publication number: 20220367117Abstract: A method for manufacturing a multilayer electronic component includes: preparing first ceramic green sheets on which first internal electrode patterns are formed spaced apart from each other and second ceramic green sheets on which second internal electrode patterns are formed spaced apart from each other; forming a ceramic green sheet stack by stacking the first ceramic green sheets and the second ceramic green sheets for the first internal electrode patterns and the second internal electrode patterns to be cross-stacked on each other; obtaining a multilayer body by cutting the ceramic green sheet stack to have a side surface to which distal edges of the first and second internal electrode patterns are exposed; adhering an adhesive layer to the side surface to which the distal edges of the first and second internal electrode patterns of the multilayer body are exposed; and peeling the adhesive layer from the side surface.Type: ApplicationFiled: January 14, 2022Publication date: November 17, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Myung Chan Son, Eun Jung Lee, Jung Tae Park, Min Woo Kim, Chang Ho Seo, Sung Soo Choi, Sun Mi Kim
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Publication number: 20220130612Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, and further including a plurality of internal electrodes having a dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the body and connected to the internal electrodes. The body further includes an active portion in which the plurality of internal electrodes are located to form capacitance and a side margin portion covering a first surface and a second surface of the active portion opposing each other. An average grain size of a dielectric layer included in the active portion is different from an average grain size of a dielectric layer included in the margin portion. The side margin portion includes an extending portion extending between the external electrodes and the internal electrodes to cover a portion of the internal electrodes.Type: ApplicationFiled: April 5, 2021Publication date: April 28, 2022Inventors: Jong Ho LEE, Chang Ho SEO, Eun Jung LEE, Myung Chan SON, Jung Tae PARK, Chang Soo PARK, Min Woo KIM
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Publication number: 20220115181Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes and external electrodes disposed on an external surface of the body and connected to the internal electrodes. The body includes a first surface and a second surface to which the internal electrodes are exposed, the first surface and the second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction which is a direction in which the dielectric layers are stacked, and a fifth surface and a sixth surface opposing each other in a third direction. At least one of the internal electrodes include a first bottleneck structure having a first directional length of a third-directional outer region smaller than an inner region thereof and a second bottleneck structure having a third directional length of a first directional outer region smaller than an inner region thereof.Type: ApplicationFiled: March 18, 2021Publication date: April 14, 2022Inventors: Jong Ho Lee, Myung Chan Son, Sim Chung Kang, Eun Jin Shim, Sun Hwa Kim, Byung Soo Kim