Patents by Inventor Myung Geon PARK

Myung Geon PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MODULE SUBSTRATE THAT ALLOWS REPLACEMENT OF FAULTY CHIPS, SEMICONDUCTOR MODULE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE
    Publication number: 20110309529
    Abstract: A module substrate may include a substrate body on which a plurality of chip mounting regions having connection pads are defined. Repair structures may be respectively formed, or placed, in the chip mounting regions. Each repair structure includes conductive layer patterns formed over the connection pads in each chip mounting region, an insulation layer pattern formed over the substrate body in each chip mounting region in such a way as to expose the conductive layer patterns, plastic conductive members formed between the connection pads and the conductive layer patterns, and a plastic insulation member formed between the substrate body and the insulation layer pattern in each chip mounting region.
    Type: Application
    Filed: December 29, 2010
    Publication date: December 22, 2011
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Ki Young KIM, Sung Ho HYUN, Myung Geon PARK, Jin Ho BAE