Abstract: An exposure mask of a semiconductor device comprises a substrate. Recesses are etched on a surface of the substrate to change a refractive index of an incident light. The changed refractive index causes a diffraction angle of the incident light to increase or decrease. As a result of the change in the diffraction angle, ultra fine patterns for highly integrated semiconductor devices may be formed without being adversely impacted by a proximity effect.

Abstract: A method for manufacturing a semiconductor device comprising dishing a part of a center of an isolation oxide film to form an overlay vernier having a step difference, prevents an attack in a CMP process of a gate polysilicon layer and improves an overlay characteristic due to the right-and-left symmetrical structure of the overlay vernier.

Abstract: An exposure mask of a semiconductor device comprises a substrate. Recesses are etched on a surface of the substrate to change a refractive index of an incident light. The changed refractive index causes a diffraction angle of the incident light to increase or decrease. As a result of the change in the diffraction angle, ultra fine patterns for highly integrated semiconductor devices may be formed without being adversely impacted by a proximity effect.

Abstract: A method for manufacturing a semiconductor device comprising dishing a part of a center of an isolation oxide film to form an overlay vernier having a step difference, prevents an attack in a CMP process of a gate polysilicon layer and improves an overlay characteristic due to the right-and-left symmetrical structure of the overlay vernier.

Abstract: The present invention provides novel photoresist monomers, and photoresist polymers comprising the same. The photoresist monomer of the present invention is selected from the group consisting of compounds of the formulas: wherein R1 to R4 and n are those defined herein. The photoresist compositions comprising the photoresist polymers of the present invention have high transparency in a deep ultraviolet light region, and also have excellent etching resistance, heat resistance, sensitivity, adhesiveness and resolution. Accordingly, the photoresist composition is suitable for lithography process using a deep ultraviolet light sources such as ArF, KrF, VUV, EUV, E-beam and X-ray for fabricating minute circuit of a high integration semiconductor device.

Abstract: The present invention provides a photomask for forming excellent photoresist patterns without the decrease of a critical area and the bulk effect caused by the topology of a photoresist on formed a wafer, by making the mask have different transmissivity in accordance with the topology of a wafer surface. In forming first contact holes and second contact holes in photoresist film formed on a wafer, wherein the first contact holes are deeper than the second contact holes, the photomask comprises a transparent substrate, transmissivity controlling films positioned over areas in which the second contact holes are formed, and light blocking patterns. The impurities control transmissivity, by absorbing light.