Patents by Inventor Myung Hwa You

Myung Hwa You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer electronic component and method of manufacturing the same
    Patent number: 11574774
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: February 7, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Tae Han, Sun Ho Yoon, Jeong Ryeol Kim, Myung Hwa You, Young Joon Oh, Seul A Park
  • MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220076891
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.
    Type: Application
    Filed: April 2, 2021
    Publication date: March 10, 2022
    Inventors: Jun Tae Han, Sun Ho Yoon, Jeong Ryeol Kim, Myung Hwa You, Young Joon Oh, Seul A Park