Abstract: A power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.

Abstract: An embodiment provides a power module that includes a first substrate comprising first material, a plurality of first switching elements on the first substrate, a second substrate comprising second material having a lower thermal conductivity than the first material, a plurality of second switching elements and a third switching element on the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

Abstract: An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

Abstract: A power module makes it possible to simplify an assembly process by disposing a compact, unified insulating substrate in a single casing, reduce overall size by selectively applying the insulating substrate according to specifications of the power module, and improve reliability by preventing a decrease in lifespan due to heat as the size of the insulating substrate is reduced. In other words, by placing the compact, unified insulating substrate in parallel in the casing, the assembly process of the insulating substrate may be facilitated, and as the size of the insulating substrate is reduced, the performance and reliability of the power module can be improved.

Abstract: A power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.

Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.

Abstract: A power module may include: a positive terminal connected to a positive pole of a battery; a negative terminal connected to a negative pole of the battery; an output terminal connected to a winding among multiple windings included in a motor; a changeover terminal connected to a neutral point regarding the multiple windings; a top switch connected between the positive terminal and the output terminal; a bottom switch connected between the negative terminal and the output terminal; and a changeover switch connected to the changeover terminal and configured to form a common node with at least one of the top switch or the bottom switch.

Abstract: A power module comprises a chip, a power lead electrically connected to the chip and at least one substrate, each of at least one substrate including an outer metal layer bonded to an outer side portion of an insulating layer and an inner metal layer bonded to an inner side portion of the insulating layer, respectively, wherein the outer metal layer and the inner metal layer have different perimeters so that the outer metal layer and the inner metal layer have asymmetric structures.

Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.

Abstract: An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

Abstract: A motor driving apparatus includes a motor including windings respectively corresponding to a plurality of phases, a first inverter including at least one first power module and providing an AC voltage corresponding to each of the phases to one end of the windings, a second inverter including a plurality of second power modules each including a changeover switch and providing the AC voltage corresponding to each of the phases to the other end of the windings based on information indicating whether the changeover switch is turned on, and a controller connected to the changeover switch and configured to control whether the changeover switch is turned on according to a motor driving mode, wherein each of the second power modules has a changeover terminal to which a first end of the changeover switch is connected, and the changeover terminals of the plurality of second power modules are short-circuited to each other.

Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.

Abstract: A power module includes a power semiconductor device, a first power lead electrically connected to a first power terminal of the power semiconductor device, a second power lead disposed in parallel to the first power lead near the first power lead and electrically connected to a second power terminal of the power semiconductor device, and a conductive plate disposed to be spaced apart from the first power lead or the second power lead by a predetermined distance such that a region overlapping with the first power lead or the second power lead is formed.

Abstract: A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electrically connecting at least two among the chip, the upper substrate and the lower substrate to transmit an electrical signal, and an insulating portion positioned between the plurality of metal portions and insulating the metal portions.

Abstract: A power module includes a power semiconductor device, a first power lead electrically connected to a first power terminal of the power semiconductor device, a second power lead disposed in parallel to the first power lead near the first power lead and electrically connected to a second power terminal of the power semiconductor device, and a conductive plate disposed to be spaced apart from the first power lead or the second power lead by a predetermined distance such that a region overlapping with the first power lead or the second power lead is formed.

Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.

Abstract: An embodiment relates to a heat transfer device including a heat generating device configured to generate heat having predetermined intensity by a user, a cover in contact with a body of the user while covering the heat generating device, and a heat transfer medium provided between the heat generating device and the cover to transfer the heat generated by the heat generating device, wherein the heat transfer medium is a structure that is formed by entangling a single wire having a predetermined length and has a predetermined width and a predetermined height, and is a structure that is compressed in an axial direction when being in contact with the body of the user and thus has a Poisson's ratio of 0.5 or higher. Thus, a structural change in the heat generating device is not required and only a material in contact with the heat generating device is changed, so that generated heat may more rapidly reach the body of the user.

Abstract: An embodiment relates to a heat transfer device including a heat generating device configured to generate heat having predetermined intensity by a user, a cover in contact with a body of the user while covering the heat generating device, and a heat transfer medium provided between the heat generating device and the cover to transfer the heat generated by the heat generating device, wherein the heat transfer medium is a structure that is formed by entangling a single wire having a predetermined length and has a predetermined width and a predetermined height, and is a structure that is compressed in an axial direction when being in contact with the body of the user and thus has a Poisson's ratio of 0.5 or higher. Thus, a structural change in the heat generating device is not required and only a material in contact with the heat generating device is changed, so that generated heat may more rapidly reach the body of the user.