Patents by Inventor Myung Joon YOON

Myung Joon YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device package and display device including the same
    Patent number: 11600687
    Abstract: An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: March 7, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung Hwan Cheong, Sung Bae Park, Myung Joon Yoon, Kyu Min Han
  • ELECTRONIC DEVICE PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
    Publication number: 20210288128
    Abstract: An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.
    Type: Application
    Filed: March 11, 2021
    Publication date: September 16, 2021
    Inventors: Seung Hwan CHEONG, Sung Bae PARK, Myung Joon YOON, Kyu Min HAN