Patents by Inventor Myungki Song

Myungki Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240021452
    Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.
    Type: Application
    Filed: March 3, 2023
    Publication date: January 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Beomsoo Hwang, Kongwoo Lee, Myungki Song, Kyusang Lee, Seojoo Choi, Jinhyuk Choi
  • Publication number: 20230230865
    Abstract: A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.
    Type: Application
    Filed: December 6, 2022
    Publication date: July 20, 2023
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Jinhyuk CHOI, Kongwoo Lee, Beomsoo Hwang, Myungki Song, Duckjin Kim, Kyusang Lee, Hyunjoo Jeon
  • Publication number: 20230080991
    Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.
    Type: Application
    Filed: April 18, 2022
    Publication date: March 16, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jinhyuk Choi, Myungki Song, Kongwoo Lee, Kyusang Lee, Beomsoo Hwang, Keonwoo Kim, Jonghwi Seo