Patents by Inventor Myung Lee

Myung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9572250
    Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: February 14, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
  • Patent number: 9561579
    Abstract: A flexible solid electrolyte includes a first inorganic protective layer, an inorganic-organic composite electrolyte layer including an inorganic component and an organic component, and a second inorganic protective layer, where the inorganic-organic composite electrolyte layer is disposed between the first inorganic protective layer and the second inorganic protective layer, and the inorganic component and the organic component collectively form a continuous ion conducting path.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 7, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-wook Baek, Tae-young Kim, Young-sin Park, Jae-myung Lee
  • Patent number: 9559396
    Abstract: A solid ion conductor including a garnet oxide represented by Formula 1: L5+x+2y(Dy,E3-y)(Mez,M2-z)Od??Formula 1 wherein L is at least one of a monovalent cation or a divalent cation, D is a monovalent cation, E is a trivalent cation, Me and M are each independently a trivalent, tetravalent, pentavalent, or a hexavalent cation, 0<x+2y?3, 0?y?0.5, 0?z<2, and 0<d?12, wherein O is partially or totally substituted with at least one of a pentavalent anion, a hexavalent anion, or a heptavalent anion; and B2O3.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: January 31, 2017
    Assignees: SAMSUNG ELECTRONICS CO., LTD., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Jae-myung Lee, Tae-young Kim, Young-sin Park, Seung-wook Baek, Jong-heun Lee, Jee-hyun Ahn
  • Publication number: 20170022885
    Abstract: An intake system of an engine having an intake duct includes an intake line disposed to transmit a gas including ambient air to a combustion chamber of an engine. An intake duct formed in a preset section of the intake line and configured to transmit the gas to the combustion chamber. The intake duct is formed of metal, and a coolant jacket formed in a preset region of an outer surface of the intake duct and disposed to cool a gas flowing in the intake duct. A coolant inlet for supplying a coolant is formed at one side of the coolant jacket and a coolant outlet for discharging the coolant is formed at another side of the coolant jacket.
    Type: Application
    Filed: December 3, 2015
    Publication date: January 26, 2017
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Joon Myung Lee, Sung Soo Kim, Kyoung Ik Jang, Jeonjin Park
  • Publication number: 20170018796
    Abstract: A flexible solid electrolyte includes a first inorganic protective layer, an inorganic-organic composite electrolyte layer including an inorganic component and an organic component, and a second inorganic protective layer, where the inorganic-organic composite electrolyte layer is disposed between the first inorganic protective layer and the second inorganic protective layer, and the inorganic component and the organic component collectively form a continuous ion conducting path.
    Type: Application
    Filed: September 8, 2016
    Publication date: January 19, 2017
    Inventors: Seung-wook BAEK, Tae-young KIM, Young-sin PARK, Jae-myung LEE
  • Patent number: 9549465
    Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: January 17, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Woo Yoo, Yeong Uk Seo, Byeong Ho Kim, Hyun Seok Seo, Sang Myung Lee, Ki Do Chun
  • Patent number: 9538105
    Abstract: A digital double sampling method, a related complementary metal oxide semiconductor (CMOS) image sensor, and a digital camera comprising the CMOS image sensor are disclosed. The method includes generating first digital data corresponding to an initial voltage level apparent in a pixel in response to a reset signal, inverting the first digital data, outputting a detection voltage corresponding to image data received from outside of the CMOS image sensor, and counting in synchronization with a clock signal, starting from an initial value equal to the inverted first digital data, and for an amount of time responsive to a voltage level of the detection voltage.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: January 3, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Myung Lee, Gun-Hee Han, Seog-Heon Ham
  • Patent number: 9534832
    Abstract: A structure for packaging an interior part such as a shelf and a door guard to prevent the interior part from being damaged due to impact and friction during transportation of a refrigerator is provided. Each of the shelf and the door guard may be accommodated in a shock-absorbing member in a state of being separated from each mounting portion to be fixed within a storage chamber. The shock-absorbing member coupled with the shelf or the door guard may be packaged by a package member and be fixed to a shelf mounting portion of an inner case.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: January 3, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Kyu Moon, Hyun Myung Lee, Eui Young Chang, Gyu Hyun Jo, Chang Sun Lee
  • Patent number: 9532462
    Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: December 27, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yeong Uk Seo, Sung Woon Yoon, Jin Su Kim, Myoung Hwa Nam, Sang Myung Lee, Chi Hee Ahn
  • Patent number: 9519402
    Abstract: A screen display method by which to configure a screen in which media objects are moved according to navigational inputs in order to easily browse for a desired media object from among a plurality of media objects. The screen display method in a mobile terminal includes displaying media objects to be piled up at first and second positions and media objects to be arranged along a course that connects the first and second positions; and displaying the piled-up media objects at one of the first and second positions to be sequentially moved along the course toward the other of the first and second positions when an input event occurs.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: December 13, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Seung-Myung Lee
  • Patent number: 9521310
    Abstract: An method and apparatus focus on a subject in a digital image processing device, the apparatus including a digital signal processor (DSP) for focusing on a subject based on an eye detected from a face of a subject having a greater ratio than a predetermined ratio in a picture.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: December 13, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae-myung Lee
  • Patent number: 9514713
    Abstract: A timing controller, a source driver, and a display driver integrated circuit (DDI) having improved test efficiency and a method of operating the DDI are provided. The timing controller includes a code generation unit for generating a first code from display data, a protocol encoder for generating a data sequence including the display data and the first code, and a transmission unit for providing the data sequence to a source driver through a link.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: December 6, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Myung Lee, Young-Min Choi, Jae-Youl Lee, Han-Su Pae, Dong-Hoon Baek, Young-Hun Lee, Kil-Hoon Lee
  • Patent number: 9497853
    Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: November 15, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
  • Publication number: 20160330251
    Abstract: According to various embodiments, a method includes: establishing, by a first electronic device, communication with at least one electronic device associated with a first application and located outside the electronic device; identifying, by the first electronic device, at least one second electronic device to execute at least one second application associated with the first application from among the at least one electronic device based on the first application; and transmitting, by the first electronic device, a content related to the at least one second application to the at least one second electronic device. Various embodiments are possible.
    Type: Application
    Filed: December 2, 2014
    Publication date: November 10, 2016
    Inventors: Jong-Myung LEE, Byung-Hyun AHN
  • Patent number: 9491866
    Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without perfolining a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: November 8, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Byeong Ho Kim, Jin Su Kim, Myoung Hwa Nam, Yeong Uk Seo, Sung Woon Yoon
  • Patent number: 9476198
    Abstract: The present invention relates to a glass fiberboard and to a production method therefor, and more specifically, to technology for providing a glass fiberboard for vacuum heat insulation and a production method therefor, which have outstanding initial heat insulation performance and economic advantages through application of an optimized inorganic binder.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: October 25, 2016
    Assignee: LG HAUSYS, LTD.
    Inventors: Myung Lee, Seong-Moon Jung, Suk Jang, Eun-Joo Kim
  • Patent number: D767622
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: September 27, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Myung Lee, Jin-Mi Choi, Jung-Yeob Oh
  • Patent number: D768713
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: October 11, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Myung Lee, Jin-Mi Choi, Jung-Yeob Oh
  • Patent number: D771088
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 8, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Daewon Kim, Jee Yeun Wang, Kyung Dae Park, Seung Myung Lee
  • Patent number: D772287
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 22, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joah Choi, Ji Hyun Ahn, Seung Myung Lee