Patents by Inventor Myung Nam

Myung Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154110
    Abstract: Cathodes and lithium secondary batteries including the cathodes are disclosed. In some implementations, a cathode may include a cathode current collector and a cathode active material layer disposed on the cathode current collector and including cathode active material particles such that the cathode active material layer satisfies a specific equation. The cathode active material particles may include lithium metal oxide particles that include nickel, and may have a mole fraction of cobalt of 0.02 or less with respect to all elements except for lithium and oxygen.
    Type: Application
    Filed: August 28, 2023
    Publication date: May 9, 2024
    Inventors: Yong Seok LEE, Jeong Hoon JEUN, Jae Ram KIM, Jae Yun MIN, Ki Joo EOM, Myung Ro LEE, Hyun Joong JANG, Je Nam CHOI
  • Publication number: 20240097125
    Abstract: A cathode for a lithium secondary battery includes a cathode current collector, and a cathode active material layer formed on the cathode current collector. The cathode active material layer includes cathode active material particles. The cathode active material particles include a lithium metal oxide particle containing nickel and having a mole fraction of cobalt of 0.02 or less among all elements except lithium and oxygen.
    Type: Application
    Filed: July 11, 2023
    Publication date: March 21, 2024
    Inventors: Yong Seok LEE, Jeong Hoon JEUN, Jae Ram KIM, Jae Yun MIN, Ki Joo EOM, Myung Ro LEE, Hyun Joong JANG, Je Nam CHOI
  • Patent number: 11113944
    Abstract: A walking analysis method includes measuring impacts due to floor landing occurring during walking; identifying an impact section before floor landing, a free fall section, and an impact peak section by floor landing in an impact graph over time; analyzing at least one impact-related parameter for the impact section before floor landing, the free fall section, and the impact peak section by floor landing; and determining a walking-related accident type according to a result of analyzing the at least one impact-related parameter. Accordingly, by classifying and detecting a variety of accidents that may actually occur, the main walking characteristics that are dangerous in the actual accident can be extracted.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: September 7, 2021
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Min Gi Jeong, Jeong Kyun Kim, Myung Nam Bae, Kang Bok Lee, Sang Yeoun Lee
  • Publication number: 20210090418
    Abstract: A walking analysis method includes measuring impacts due to floor landing occurring during walking; identifying an impact section before floor landing, a free fall section, and an impact peak section by floor landing in an impact graph over time; analyzing at least one impact-related parameter for the impact section before floor landing, the free fall section, and the impact peak section by floor landing; and determining a walking-related accident type according to a result of analyzing the at least one impact-related parameter. Accordingly, by classifying and detecting a variety of accidents that may actually occur, the main walking characteristics that are dangerous in the actual accident can be extracted.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 25, 2021
    Inventors: Min Gi JEONG, Jeong Kyun KIM, Myung Nam BAE, Kang Bok LEE, Sang Yeoun LEE
  • Patent number: 10341930
    Abstract: A mobile ad-hoc routing apparatus includes a first communication module and a second communication module configured to transmit and receive data through a first communication band and a second communication band, respectively, a memory configured to store a program for transmitting and receiving the data, and a processor configured to execute the program stored in the memory, wherein when the program is executed, the processor receives first control information broadcast by one or more neighboring nodes via the first communication module and stores the first control information in the memory, wherein the first control information includes current position and communication status information of the neighboring node, the processor updates information on the neighboring node on the basis of the first control information, generates packet forwarding information which includes information on a node which currently allows packet data to be transmitted based on the updated information on the neighboring node, and
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: July 2, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Myung eun Kim, Tae Joon Park, Sun Jin Kim, Jong Hyun Park, Hyo Chan Bang, Myung Nam Bae, Dong Beom Shin, Hoe Sung Yang, Kang Bok Lee, Sang Yeoun Lee, Hye Sun Lee, Jin Chul Choi, Sang Gi Hong
  • Patent number: 10229566
    Abstract: An operation method of a first apparatus for supporting disaster communications includes obtaining map information of a disaster area from a server; obtaining information on a location of the first apparatus, and obtaining environmental condition information of the first apparatus indicating a risk of an area to which the first apparatus belongs; obtaining information on a location and environmental condition information of a second apparatus located in the disaster area from the second apparatus; determining a disaster risk level indicating a risk level for each location in the disaster area based on the location and environmental condition information of the first apparatus and the location and environmental condition information of the second apparatus; and updating the map information by reflecting the disaster risk level.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: March 12, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hye Sun Lee, Myung Nam Bae, Sang Gi Hong, Hyo Chan Bang, Kang Bok Lee, Dong Beom Shin, Sang Yeoun Lee, Kyo Hoon Son, Hoe Sung Yang, Jin Chul Choi
  • Patent number: 10225723
    Abstract: A method and apparatus for controlling a transmission signal for a disaster scene communication system. The method includes determining a type of a transmission message transmitted to a mobile terminal device by a control terminal device of the disaster scene communication system, determining a criticality level of the transmission message corresponding to the type of the transmission message, determining an initial distance between the control terminal device and the mobile terminal device by checking initial location information of the mobile terminal device, setting an initial transmission power in consideration of the criticality level of the transmission message corresponding to the type of the transmission message and the initial distance between the mobile terminal device and the control terminal device, and controlling a current transmission power based on the initial transmission power.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: March 5, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kyo Hoon Son, Myung Nam Bae, Kang Bok Lee, Hye Sun Lee, Min Gi Jeong, Sang Gi Hong
  • Patent number: 10062812
    Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: August 28, 2018
    Assignee: Point Engineering Co., Ltd.
    Inventors: Ki Myung Nam, Seung Ho Park, Tae Hwan Song
  • Patent number: 10008638
    Abstract: The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: June 26, 2018
    Assignee: Point Engineering Co., Ltd.
    Inventors: Bum Mo Ahn, Seung Ho Park, Ki Myung Nam
  • Publication number: 20180165929
    Abstract: An operation method of a first apparatus for supporting disaster communications includes obtaining map information of a disaster area from a server; obtaining information on a location of the first apparatus, and obtaining environmental condition information of the first apparatus indicating a risk of an area to which the first apparatus belongs; obtaining information on a location and environmental condition information of a second apparatus located in the disaster area from the second apparatus; determining a disaster risk level indicating a risk level for each location in the disaster area based on the location and environmental condition information of the first apparatus and the location and environmental condition information of the second apparatus; and updating the map information by reflecting the disaster risk level.
    Type: Application
    Filed: November 21, 2017
    Publication date: June 14, 2018
    Inventors: Hye Sun Lee, Myung Nam Bae, Sang Gi Hong, Hyo Chan Bang, Kang Bok Lee, Dong Beom Shin, Sang Yeoun Lee, Kyo Hoon Son, Hoe Sung Yang, Jin Chul Choi
  • Publication number: 20180130444
    Abstract: An information image display apparatus includes an illuminance sensor sensing illuminance of incident light; a processor for determining a transmittance of a polarizer according to the illuminance sensed by the illuminance sensor, outputting a control signal according to the sensed illuminance, analyzing an entire or partial area of a foreground image of external environment to determine a dominant color of the entire or partial area, and displaying an information image using a color contrasted with dominant color; and a polarizer for selectively transmitting the incident light by adjusting a degree of polarization according to the control signal input from the processor.
    Type: Application
    Filed: November 7, 2017
    Publication date: May 10, 2018
    Inventors: Seung Il MYONG, Dong Beom SHIN, Kang Bok LEE, Myung Nam BAE
  • Patent number: 9847462
    Abstract: Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: December 19, 2017
    Assignee: Point Engineering Co., Ltd.
    Inventors: Ki Myung Nam, Seung Ho Park, Young Chul Jun
  • Patent number: 9818913
    Abstract: A chip substrate includes at least one insulation portion interposed between conductive portions. A cavity formed in a recessed shape from a region of an upper surface of the chip substrate exposes a top surface of a part of the at least one insulation portion. An insulation layer is coated on the upper surface of the chip substrate excluding the region of the cavity. A bump may be formed at a predetermined height within the cavity.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: November 14, 2017
    Assignee: Point Engineering Co., Ltd.
    Inventors: Ki Myung Nam, Young Woon Jeon, Kyoung Ja Yun
  • Patent number: 9773210
    Abstract: There is provided a system for providing information. The system includes a data classifying device configured to receive original data and classify the original data as real time data or general data; a real time data analyzing device configured to receive the real time data from the data classifying device and generate condensed information including only a part that satisfies predefined conditions among attribute information of the real time data; and a distributed parallel processing device configured to receive the general data from the data classifying device, perform a predetermined distributed parallel computation process on the general data, and generate analysis information.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: September 26, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae-Hak Yu, Hyun-Joong Kang, Mal-Hee Kim, Hyo-Chan Bang, Myung-Nam Bae
  • Publication number: 20170273004
    Abstract: Provided are an apparatus and method for performing routing for multi-hop communication. A mobile ad-hoc routing apparatus includes a control information manager configured to generate control information for managing a topology in a mobile ad-hoc network, a control information transceiver configured to transmit the control information or information for generating the control information to other nodes and receives control information of the other nodes or information for generating the control information from the other nodes, a data path manager configured to set a path for transmitting and receiving data using the generated control information and the received control information or the information for generating the control information, and a data transceiver configured to transmit and receive the data through the set path. The path for transmitting and receiving the data and a path for transmitting and receiving the control information use channels that are physically different from each other.
    Type: Application
    Filed: January 10, 2017
    Publication date: September 21, 2017
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Tae Joon PARK, Myung Eun KIM, Sun Jin KIM, Myung Nam BAE, Dong Beom SHIN, Hoe Sung YANG, Kang Bok LEE, Sang Yeoun LEE, Hye Sun LEE, Jin Chul CHOI, Sang Gi HONG, Hyo Chan BANG, Jong Hyun PARK
  • Patent number: 9666565
    Abstract: The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: May 30, 2017
    Assignee: Point Engineering Co., Ltd.
    Inventors: Ki Myung Nam, Tae-Hwan Song, Young-Chul Jun
  • Patent number: 9666558
    Abstract: Disclosed is a chip-mounting substrate. The chip-mounting substrate includes a plurality of conductive portions configured to apply voltages to at least two or more chips to be mounted, a plurality of insulation portions formed between the conductive portions and configured to electrically isolate the conductive portions, and a cavity formed in a region which includes at least three or more of the conductive portions and at least two or more of the insulation portions and depressed inward to form a space in which the chips are mounted.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 30, 2017
    Assignee: Point Engineering Co., Ltd.
    Inventors: Bum Mo Ahn, Ki Myung Nam, Seung Ho Park
  • Publication number: 20170150418
    Abstract: A mobile ad-hoc routing apparatus includes a first communication module and a second communication module configured to transmit and receive data through a first communication band and a second communication band, respectively, a memory configured to store a program for transmitting and receiving the data, and a processor configured to execute the program stored in the memory, wherein when the program is executed, the processor receives first control information broadcast by one or more neighboring nodes via the first communication module and stores the first control information in the memory, wherein the first control information includes current position and communication status information of the neighboring node, the processor updates information on the neighboring node on the basis of the first control information, generates packet forwarding information which includes information on a node which currently allows packet data to be transmitted based on the updated information on the neighboring node, and
    Type: Application
    Filed: November 23, 2016
    Publication date: May 25, 2017
    Inventors: Myung Eun KIM, Tae Joon PARK, Sun Jin KIM, Jong Hyun PARK, Hyo Chan BANG, Myung Nam BAE, Dong Beom SHIN, Hoe Sung YANG, Kang Bok LEE, Sang Yeoun LEE, Hye Sun LEE, Jin Chul CHOI, Sang Gi HONG
  • Publication number: 20170141274
    Abstract: A chip substrate includes at least one insulation portion interposed between conductive portions. A cavity formed in a recessed shape from a region of an upper surface of the chip substrate exposes a top surface of a part of the at least one insulation portion. An insulation layer is coated on the upper surface of the chip substrate excluding the region of the cavity. A bump may be formed at a predetermined height within the cavity.
    Type: Application
    Filed: January 31, 2017
    Publication date: May 18, 2017
    Inventors: Ki Myung Nam, Young Woon Jeon, Kyoung Ja Yun
  • Patent number: 9653664
    Abstract: Disclosed is a chip substrate. The chip substrate includes: conductive portions laminated in one direction to constitute the chip substrate; insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions; a cavity formed at a predetermined depth in a recessed shape in a region including the insulation portions on an upper surface of the chip substrate; and a groove portion disposed outside the cavity in a spaced-apart relationship with the cavity and formed at a predetermined depth in a recessed shape. According to the present invention, an adhesive agent is applied in a groove portion formed in advance. It is therefore possible to prevent the adhesive agent from being exposed to the light emitted from optical elements and to prevent the adhesive agent from being denatured. This makes it possible to enhance the reliability of lens bonding. Furthermore, there is no need to use an expensive resistant adhesive agent.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 16, 2017
    Assignee: Point Engineering Co., Ltd.
    Inventors: Sin Seok Han, Soo Young Choi, Ki Myung Nam