Abstract: A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.

Abstract: Provided is a mash-up service system including: a data processing module installed in a communication terminal which makes wired/wireless Internet communications, and transmitting multimedia data created by a user of the communication terminal and basic information provided by the communication terminal; and a mash-up server receiving the multimedia data and the basic information from the data processing module, tagging the multimedia data with the basic information to create first mash-up content, and transmitting the first mash-up content to a mash-up service apparatus.