Abstract: An apparatus for manufacturing an organic material includes an outer tube including an internal accommodating space, and at least one loading inner tube and at least one collecting inner tube disposed in the accommodation space, the loading inner tube including a mesh boat disposed in a first direction in which the loading inner tube extends.

Abstract: A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.

Abstract: According to an embodiment, an anode active material included in an anode material of a battery comprises a carbon material and a silicon structure attached to the carbon material. The silicon structure includes a silicon nanoparticle, a metal thin film formed on a surface of the silicon nanoparticle, and graphene coated on a surface of the metal thin film.

Abstract: The present invention relates to a multi-function electronic device having a memristor and a memcapacitor and a method for manufacturing the same. The multi-function electronic device having a memristor and a memcapacitor has a laminated structure of a first insulating layer comprising an organic material/an active layer/a second insulating layer comprising an organic material, and thus has a resistance and capacitance varying with the applied voltage.

Abstract: An exemplary method of preparing nitrogen-doped graphene whereby it is possible to synthesize graphene having an improved surface coverage and a uniform single layer, and to prepare high quality graphene in a large area. In addition, an aromatic compound containing nitrogen can be used as a carbon source and nitrogen-doped graphene can be thus synthesized as nitrogen doped in the synthesis process. It is possible to control the electrical properties of graphene depending on the nitrogen doping.

Abstract: A method for synthesizing a multilayer graphene is provided. Specifically, the multilayer graphene can be produced by performing a step of forming a catalytic metal layer on a substrate, a step of heat-treating the catalytic metal layer on the substrate while supplying methane gas, and a step of synthesizing a multilayer graphene on the heat-treated catalytic metal layer. As described above, the multilayer graphene having a large area can be grown directly on a substrate, by heat-treating the catalytic metal layer using methane gas, prior to the step of synthesis of graphene. In addition, as the the number of layer of the multilayer graphene can be controlled by changing the synthesis time of the multilayer graphene, the multilayer graphene with the desired number of layers can be easily produced.

Abstract: The present invention relates to a multi-function electronic device having a memristor and a memcapacitor and a method for manufacturing the same. The multi-function electronic device having a memristor and a memcapacitor has a laminated structure of a first insulating layer comprising an organic material/an active layer/a second insulating layer comprising an organic material, and thus has a resistance and capacitance varying with the applied voltage.

Abstract: An exemplary method of preparing nitrogen-doped graphene whereby it is possible to synthesize graphene having an improved surface coverage and a uniform single layer, and to prepare high quality graphene in a large area. In addition, an aromatic compound containing nitrogen can be used as a carbon source and nitrogen-doped graphene can be thus synthesized as nitrogen doped in the synthesis process. It is possible to control the electrical properties of graphene depending on the nitrogen doping.

Abstract: A method for synthesizing a multilayer graphene is provided. Specifically, the multilayer graphene can be produced by performing a step of forming a catalytic metal layer on a substrate, a step of heat-treating the catalytic metal layer on the substrate while supplying methane gas, and a step of synthesizing a multilayer graphene on the heat-treated catalytic metal layer. As described above, the multilayer graphene having a large area can be grown directly on a substrate, by heat-treating the catalytic metal layer using methane gas, prior to the step of synthesis of graphene. In addition, as the the number of layer of the multilayer graphene can be controlled by changing the synthesis time of the multilayer graphene, the multilayer graphene with the desired number of layers can be easily produced.

Abstract: A resistive random access memory (ReRAM) includes a first electrode, a threshold switching layer formed over the first electrode and configured to perform a switching operation according to an applied voltage, a resistance change layer formed over the threshold switching layer, and configured to perform a resistance change operation, and a second electrode formed over the resistance change layer, wherein the threshold switching layer comprises a stoichiometric transition oxide while the resistance change layer comprises a non-stoichiometric transition metal oxide.

Abstract: A resistive random access memory (ReRAM) includes a first electrode, a threshold switching layer formed over the first electrode and configured to perform a switching operation according to an applied voltage, a resistance change layer formed over the threshold switching layer, and configured to perform a resistance change operation, and a second electrode formed over the resistance change layer, wherein the threshold switching layer comprises a stoichiometric transition oxide while the resistance change layer comprises a non-stoichiometric transition metal oxide.