Patents by Inventor Myung You, III

Myung You, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND STRUCTURE TO CONTROL THE SOLDER THICKNESS FOR DOUBLE SIDED COOLING POWER MODULE
    Publication number: 20210327842
    Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.
    Type: Application
    Filed: September 28, 2020
    Publication date: October 21, 2021
    Applicants: Huyndai Motor Company, Kia Motors Corporation
    Inventors: Tae Hwa KIM, Myung You, III