Patents by Inventor Myunggwan PARK

Myunggwan PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230004199
    Abstract: An electronic device includes a housing, a first substrate disposed in an internal space of the housing, a conductive structure disposed at a location isolated from the first substrate, a second substrate electrically connected to the conductive structure and the first substrate, and an electrical connection member electrically connecting the second substrate to the conductive structure. The electrical connection member may include a first fixing portion fixed to the conductive structure, a second fixing portion fixed to the second substrate, and a connection portion connecting the first fixing portion and the second fixing portion. The first fixing portion includes a first bent portion bent along a first bent line from a neck portion, that is, a boundary area with the connection portion, and a second bent portion bent along a second bent line from the first bent portion.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 5, 2023
    Inventors: Sunghyup LEE, Beomju KIM, Myunggwan PARK, Jungsik PARK, Yeohwan YOON, Hyunwoo LEE, Yongchan CHOI, Hyunju HONG