Patents by Inventor Myung-Heon KANG

Myung-Heon KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190027812
    Abstract: Various embodiments disclose an electronic device comprising a housing, said housing comprising: at least one metallic material portion; and a synthetic resin material portion, said synthetic resin material comprising a sealing resin, the synthetic resin material portion joined and injection molded to at least a part of the at least one metallic material portion, wherein the sealing resin is disposed at at least a portion of a joint between the metallic material portion and the synthetic resin material portion.
    Type: Application
    Filed: April 5, 2018
    Publication date: January 24, 2019
    Inventors: Koang-Soo KIM, Myung-Heon KANG, Seong-Hyeon KIM, Young-Tae LEE, Soon-Wan CHUNG, Eon-Seog CHEON