Patents by Inventor Myung-Joo LEE

Myung-Joo LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154110
    Abstract: Cathodes and lithium secondary batteries including the cathodes are disclosed. In some implementations, a cathode may include a cathode current collector and a cathode active material layer disposed on the cathode current collector and including cathode active material particles such that the cathode active material layer satisfies a specific equation. The cathode active material particles may include lithium metal oxide particles that include nickel, and may have a mole fraction of cobalt of 0.02 or less with respect to all elements except for lithium and oxygen.
    Type: Application
    Filed: August 28, 2023
    Publication date: May 9, 2024
    Inventors: Yong Seok LEE, Jeong Hoon JEUN, Jae Ram KIM, Jae Yun MIN, Ki Joo EOM, Myung Ro LEE, Hyun Joong JANG, Je Nam CHOI
  • Patent number: 11978901
    Abstract: A cathode for a lithium secondary battery includes a cathode current collector, and a cathode active material layer formed on the cathode current collector. The cathode active material layer includes a cathode active material and a conductive material ID/IG is in a range from 0.5 to 1.25 in a Raman spectrum of the cathode active material layer. The cathode active material includes lithium metal oxide particles containing nickel and manganese and having a content of cobalt of less than 2 mol % among all elements except for lithium and oxygen.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: May 7, 2024
    Assignee: SK ON CO., LTD.
    Inventors: Yong Seok Lee, Jae Ram Kim, Ji Won Na, Sang Won Bae, Yeon Hwa Song, Ki Joo Eom, Myung Ro Lee, Jae Yeong Lee, Hyun Joong Jang
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240120224
    Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin Hyuk CHOI, Beom Soo HWANG, Kong Woo LEE, Myung Ki SONG, Ja-Yul KIM, Kyu Sang LEE, Hyun Joo JEON, Nam Young CHO
  • Publication number: 20240097125
    Abstract: A cathode for a lithium secondary battery includes a cathode current collector, and a cathode active material layer formed on the cathode current collector. The cathode active material layer includes cathode active material particles. The cathode active material particles include a lithium metal oxide particle containing nickel and having a mole fraction of cobalt of 0.02 or less among all elements except lithium and oxygen.
    Type: Application
    Filed: July 11, 2023
    Publication date: March 21, 2024
    Inventors: Yong Seok LEE, Jeong Hoon JEUN, Jae Ram KIM, Jae Yun MIN, Ki Joo EOM, Myung Ro LEE, Hyun Joong JANG, Je Nam CHOI
  • Patent number: 10699850
    Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 30, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Yong Lee, Yu Ra Shin, Hak Kwan Kim, Jin Bok Shin, Myung Joo Lee
  • Publication number: 20190333699
    Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 31, 2019
    Inventors: Seung Yong LEE, Yu Ra SHIN, Hak Kwan KIM, Jin Bok SHIN, Myung Joo LEE
  • Patent number: 10286827
    Abstract: The present disclosure relates to a footrest for a car seat, and more particularly, relates to a position adjusting device applied to a footrest for a car seat, including an adhering member adhered to an outer circumferential surface of the guide bar and a pressing member pressing the adhering member. The adhering member includes a first adhering plate adhered to the outer circumferential surface of the guide bar, a second adhering plate coupled to the first adhering plate, an elastic member disposed between the first adhering plate and the second adhering plate, and a contact member disposed between the first adhering plate and the second adhering plate to accommodate the elastic member. The contact member makes contact with the outer circumferential surface of the guide bar through a contact hole defined through the first adhering plate.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: May 14, 2019
    Inventor: Myung Joo Lee
  • Publication number: 20180118074
    Abstract: The present disclosure relates to a footrest for a car seat, and more particularly, relates to a position adjusting device applied to a footrest for a car seat, including an adhering member adhered to an outer circumferential surface of the guide bar and a pressing member pressing the adhering member. The adhering member includes a first adhering plate adhered to the outer circumferential surface of the guide bar, a second adhering plate coupled to the first adhering plate, an elastic member disposed between the first adhering plate and the second adhering plate, and a contact member disposed between the first adhering plate and the second adhering plate to accommodate the elastic member. The contact member makes contact with the outer circumferential surface of the guide bar through a contact hole defined through the first adhering plate.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 3, 2018
    Inventor: Myung Joo LEE
  • Publication number: 20110201202
    Abstract: A method of forming fine patterns of a semiconductor device, the method including providing a patternable layer; forming a plurality of first photoresist layer patterns on the patternable layer; forming an interfacial layer on the patternable layer and the plurality of first photoresist layer patterns; forming a planarization layer on the interfacial layer; forming a plurality of second photoresist layer patterns on the planarization layer; forming a plurality of planarization layer patterns using the plurality of second photoresist layer patterns; and forming a plurality of layer patterns using the plurality of planarization layer patterns and the plurality of first photoresist layer patterns.
    Type: Application
    Filed: January 14, 2011
    Publication date: August 18, 2011
    Inventors: Chong-Kwang CHANG, Young-Mook OH, Seo-Woo NAM, Woo-Cheol JEON, Ju-Beom YI, Myung-Joo LEE