Abstract: A method and apparatus for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The pattern mask may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double sided printed circuit boards.

Abstract: A method for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The direct printing methods include correcting positional errors in a printing apparatus by ascertaining the errors in the printer through comparison of a printed pattern and a known standard pattern. Printer inputs are manipulated to compensate for the ascertained errors of the printer. The pattern mask applied by the corrected printer may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double-sided printed circuit boards.

Abstract: A method and apparatus for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The pattern mask may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double sided printed circuit boards.

Abstract: A method for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The direct printing methods include correcting positional errors in a printing apparatus by ascertaining the errors in the printer through comparison of a printed pattern and a known standard pattern. Printer inputs are manipulated to compensate for the ascertained errors of the printer. The pattern mask applied by the corrected printer may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double-sided printed circuit boards.

Abstract: A method and apparatus for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The pattern mask may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double-sided printed circuit boards.

Abstract: A method for forming segmented through holes in a printed circuit board. The segmented through holes comprise a plurality of electrically conductive pathways disposed on the walls of a single through hole. The segmented through hole can be disposed in a two sided circuit board assembly or in a composite, multi layer circuit board assembly.

Abstract: A process for forming interconnection lines on a printed circuit board is described. The surface of a circuit board substrate is covered with a photoresist layer, and the photoresist layer in turn is covered with a halide emulsion layer. The emulsion layer is then exposed to a predetermined pattern of white light, and the image developed. The board is then exposed to UV light through the imaged emulsion layer which acts as a pattern masking selected portions of the photoresist mask. The emulsion layer is then stripped and the photoresist processed in conventional manner.

Abstract: Through-holes are formed in a printed circuit board substrate by chemical etching a metal foil clad circuit board having open positions in the metal foil where a hole is to be formed using N-methyl-2-pyrrolidone, a mixture of methylene chloride and HF, or a mixture of methylene chloride, HF and xylene.

Abstract: A process for forming interconnection lines on a printed circuit board is described. The surface of a circuit board substrate is covered with a photoresist layer, and the photoresist layer in turn is covered with a halide emulsion layer. The emulsion layer is then exposed to a predetermined pattern of white light, and the image developed. The board is then exposed to UV light through the imaged emulsion layer which acts as a pattern masking selected portions of the photoresist mask. The emulsion layer is then stripped and the photoresist processed in conventional manner.

Abstract: A method for fabricating at least one via or hole in a multi-layer printed circuit board comprises separately drilling the board layers, stacking and laminating the drilled board layers utilizing conformal mapping digital imaging in a computer, and then finish drilling the holes. The invention also provides a method for correcting artwork to compensate for lamination distortion.

Abstract: A method and apparatus for the uniform electroplating of printed circuit boards is described. At least one non conductive apertured mask covers selected areas of the electroactive surface of the anode or cathode electrode, whereby to establish substantially uniform electroplating ion transfer over the target areas of the target cathode.