Patents by Inventor N. Perry Cook

N. Perry Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of formation of thin bonded ultra-thin wafers
    Patent number: 5843832
    Abstract: A technique of bonding a thin wafer layer to a substrate. The wafer is blown dry using an inert gas to prevent it from being damaged, while still ensuring that it dries completely. The initial bonding is done by orienting crystallographic axes, and then allowing the wafers to adhere to one another slowly. The contact wave is prevented from spreading, by a divider between the two wafers. The wafers are allowed to adhere to one another slowly to form a bond. The bond is strengthened by annealing.
    Type: Grant
    Filed: March 1, 1995
    Date of Patent: December 1, 1998
    Assignee: Virginia Semiconductor, Inc.
    Inventors: Kenneth R. Farmer, Thomas G. Digges, Jr., N. Perry Cook