Abstract: A method for testing a partially fabricated wafer is provided that comprises the following steps: providing a plurality of selectable devices under test (DUT) overlying a substrate of the wafer; biasing a second structure located in proximity to the DUT to have a first electrical state such that a first equivalent test structure is formed; determining a first parasitic parameter associated with the first equivalent test structure by applying a signal to the DUT while the second structure is in the first electrical state and measuring a response that is indicative of the first parameter; biasing the second structure to have a second electrical state such that a second equivalent test structure is formed; and determining a second parasitic parameter associated with the second equivalent test structure by applying a signal to the DUT while the second structure is in the second electrical state and measuring a response that is indicative of the second parameter.

Abstract: A logic module 400 for use in a field programmable gate array 100 can be selectively reconfigured to perform over 1800 Boolean combinational functions on each output 431-432, to operate as a full adder with sum and carry outputs, or to form the sequential function of a D-latch or a D-flipflop. The logic module has ten input terminals 411-418, 421-422 and two output terminals 431-432. The logic module is comprised of two-input multiplexors 500 and 600 which are used to form both the combinational and sequential circuits, thereby efficiently utilizing space on gate array 100. The D-latch and D-flipflop have a preset input terminal 415 and a clear input terminal 414. Furthermore, the D-latch can be configured to be latched on either a low level or a high level clock signal on terminal 411, while the D-flipflop can be configured to be triggered by either a low to high transition or a high to low transition of a clock signal on terminal 411.