Patents by Inventor Na Bin WON

Na Bin WON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die bonding structure
    Patent number: 11876052
    Abstract: A semiconductor die bonding structure includes a lower die including a lower top bonding dielectric layer and a lower connection structure and an upper die stacked over the lower die and including an upper bottom bonding dielectric layer and an upper connection structure. The lower top bonding dielectric layer and the upper bottom bonding dielectric layer are connected. The lower connection structure and the upper connection structure are connected.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: January 16, 2024
    Assignee: SK hynix Inc.
    Inventors: Na Bin Won, Jong Hoon Kim
  • SEMICONDUCTOR DIE BONDING STRUCTURE
    Publication number: 20220216155
    Abstract: A semiconductor die bonding structure includes a lower die including a lower top bonding dielectric layer and a lower connection structure and an upper die stacked over the lower die and including an upper bottom bonding dielectric layer and an upper connection structure. The lower top bonding dielectric layer and the upper bottom bonding dielectric layer are connected. The lower connection structure and the upper connection structure are connected.
    Type: Application
    Filed: May 19, 2021
    Publication date: July 7, 2022
    Applicant: SK hynix Inc.
    Inventors: Na Bin WON, Jong Hoon KIM