Patents by Inventor Na Hye WON

Na Hye WON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing the same
    Patent number: 8716777
    Abstract: A method for forming a semiconductor device includes forming a sealing insulation film over a semiconductor substrate including a device isolation film and an active region, forming a bit line contact plug that protrudes from an upper part of the sealing insulation film and is coupled to the active region, forming a spacer over a sidewall of the protruded bit line contact plug, and forming a bit line coupled to an upper part of the bit line contact plug.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: May 6, 2014
    Assignee: SK Hynix Inc.
    Inventors: Sung Soo Kim, Na Hye Won
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130320558
    Abstract: A method for forming a semiconductor device includes forming a sealing insulation film over a semiconductor substrate including a device isolation film and an active region, forming a bit line contact plug that protrudes from an upper part of the sealing insulation film and is coupled to the active region, forming a spacer over a sidewall of the protruded bit line contact plug, and forming a bit line coupled to an upper part of the bit line contact plug.
    Type: Application
    Filed: October 11, 2012
    Publication date: December 5, 2013
    Applicant: SK HYNIX INC.
    Inventors: Sung Soo KIM, Na Hye WON