Patents by Inventor Na Hyeon SHIN

Na Hyeon SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230312901
    Abstract: A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a styrene-ethylene-butylene-styrene copolymer including about 10 to about 50 wt % of a first styrene-ethylene-butylene-styrene copolymer having a weight average molecular weight of about 250,000 to about 350,000 g/mol, and about 50 to about 90 wt % of a second styrene-ethylene-butylene-styrene copolymer having a weight average molecular weight of about 100,000 to about 200,000 g/mol; and about 1 to about 25 parts by weight of a polyolefin resin. The thermoplastic resin composition and a molded article formed therefrom are environmentally-friendly, and have excellent processability, flexibility, elastic recovery, lightweightness, durability, and the like.
    Type: Application
    Filed: August 24, 2021
    Publication date: October 5, 2023
    Inventors: Seok Beom SEO, Seung Bin PARK, Na Hyeon SHIN