Patents by Inventor Na Kyung KWON

Na Kyung KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board, an image sensor module, a lens driving device, and a camera module including the same
    Patent number: 11936968
    Abstract: A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion d
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: March 19, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Hae Sik Kim, So Hee Choi, Jee Heum Paik, Na Kyung Kwon
  • CIRCUIT BOARD, LENS DRIVING DEVICE, AND CAMERA MODULE INCLUDING THE SAME
    Publication number: 20230017158
    Abstract: A circuit board according to an embodiment includes: an insulating part; and a pattern part disposed on the insulating part, wherein the insulating part includes first and second insulating regions spaced apart from each other with an open region interposed therebetween, the pattern part includes: a first terminal portion disposed in a plurality of first side regions of the first insulating region adjacent to the open region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions with the open region interposed therebetween; and a connecting portion disposed in the open region and connecting between the first and second terminal portions, wherein the connecting portion includes a plurality of bent portions connecting between the first terminal portion and the second terminal portion disposed in the first side region and the second side region which do not face each other and formed at a plurality of corners of the ope
    Type: Application
    Filed: September 16, 2022
    Publication date: January 19, 2023
    Inventors: Na Kyung KWON, Hae Sik KIM
  • CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A CAMERA MODULE INCLUDING THE SAME
    Publication number: 20220353389
    Abstract: A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion d
    Type: Application
    Filed: April 21, 2022
    Publication date: November 3, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Hae Sik KIM, So Hee CHOI, Jee Heum PAIK, Na Kyung KWON