Abstract: A pixel circuit includes first to fifth transistors, a capacitor, and a light emitting element. The first transistor is coupled between first and second power lines, and includes a gate electrode coupled to a first node and a back-gate electrode coupled to a second node. The second transistor is coupled between a data line and the first node, and includes a gate electrode coupled to a first scan line. The third transistor is coupled between a third power line and the first node, and includes a gate electrode coupled to a reference scan line. The fourth transistor is coupled between a second node and a fourth power line, and includes a gate electrode coupled to a second scan line. The fifth transistor is coupled between a first power line and the one electrode of the first transistor, and includes a gate electrode coupled to a light-emitting control line.

Abstract: A display device includes a substrate comprising a display unit for displaying an image, a non-display unit around the display unit, and at least one first pad for sending an electrical signal to the display unit, a circuit board on the substrate and comprising at least one circuit terminal, and a conductive film between the substrate and the circuit board and including a plurality of conductive particles for electrically connecting the first pad and the circuit terminal, and an insulating resin surrounding the conductive particles, wherein the first pad includes a plurality of fine pad lines, and a region into which the insulating resin is dispersed during a thermal compressing operation located between adjacent ones of the fine pad lines.

Abstract: A display device includes a substrate comprising a display unit for displaying an image, a non-display unit around the display unit, and at least one first pad for sending an electrical signal to the display unit, a circuit board on the substrate and comprising at least one circuit terminal, and a conductive film between the substrate and the circuit board and including a plurality of conductive particles for electrically connecting the first pad and the circuit terminal, and an insulating resin surrounding the conductive particles, wherein the first pad includes a plurality of fine pad lines, and a region into which the insulating resin is dispersed during a thermal compressing operation located between adjacent ones of the fine pad lines.

Abstract: Disclosed is an image sensor module consisting of a substrate having a hole positioned at the center thereof; an image signal process package attached to the back side of the substrate; and an image sensor mounted in the hole of the substrate, and a process of fabricating the same. In addition, a camera module is provided which consists of the image sensor module; a housing covering the upper portion of the image sensor module; a lens positioned outside of the housing; a filter positioned inside of the housing; and a flexible printed circuit board connected to the back side of the substrate of the image sensor module. The image sensor module applied to the camera module can obtain a sufficient brightness while a distance between the lens and the image sensor is properly maintained to secure a desired focal distance.