Patents by Inventor Nabil G. Mistkawi
Nabil G. Mistkawi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230098459Abstract: An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 11 nanometers, fin height is greater than 155 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 15 nanometers, fin height is greater than 190 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. A method for forming a fin-based transistor structure is provided where a plurality of fins on a substrate are pre-treated with at least one of a self-assembled monolayer, a non-polar solvent, and a surfactant. One or more of these treatments is to reduce adhesion and/or cohesive forces to prevent occurrence of fin collapse.Type: ApplicationFiled: November 28, 2022Publication date: March 30, 2023Applicant: Tahoe Research, Ltd.Inventors: Nabil G. MISTKAWI, Glenn A. GLASS
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Patent number: 11538905Abstract: Techniques are disclosed for forming nanowire transistors employing carbon-based layers. Carbon is added to the sacrificial layers and/or non-sacrificial layers of a multilayer stack forming one or more nanowires in the transistor channel region. Such carbon-based layers reduce or prevent diffusion and intermixing of the sacrificial and non-sacrificial portions of the multilayer stack. The reduction of diffusion/intermixing can allow for the originally formed layers to effectively maintain their original thicknesses, thereby enabling the formation of relatively more nanowires for a given channel region height because of the more accurate processing scheme. The techniques can be used to benefit group IV semiconductor material nanowire devices (e.g., devices including Si, Ge, and/or SiGe) and can also assist with the selective etch processing used to form the nanowires.Type: GrantFiled: September 30, 2016Date of Patent: December 27, 2022Assignee: Intel CorporationInventors: Glenn A. Glass, Anand S. Murthy, Nabil G. Mistkawi, Karthik Jambunathan, Tahir Ghani
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Patent number: 11515304Abstract: An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 11 nanometers, fin height is greater than 155 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 15 nanometers, fin height is greater than 190 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. A method for forming a fin-based transistor structure is provided where a plurality of fins on a substrate are pre-treated with at least one of a self-assembled monolayer, a non-polar solvent, and a surfactant. One or more of these treatments is to reduce adhesion and/or cohesive forces to prevent occurrence of fin collapse.Type: GrantFiled: September 25, 2020Date of Patent: November 29, 2022Assignee: Tahoe Research, Ltd.Inventors: Nabil G. Mistkawi, Glenn A. Glass
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Patent number: 10944006Abstract: A trench is formed in an insulating layer to expose a native fin on a substrate. A replacement fin is deposited on the native fin in the trench. The replacement fin is trimmed laterally.Type: GrantFiled: March 30, 2016Date of Patent: March 9, 2021Assignee: Intel CorporationInventors: Glenn A. Glass, Anand S. Murthy, Karthik Jambunathan, Chandra S. Mohapatra, Hei Kam, Nabil G. Mistkawi, Jun Sung Kang, Biswajeet Guha
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Publication number: 20210020632Abstract: An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 11 nanometers, fin height is greater than 155 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 15 nanometers, fin height is greater than 190 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. A method for forming a fin-based transistor structure is provided where a plurality of fins on a substrate are pre-treated with at least one of a self-assembled monolayer, a non-polar solvent, and a surfactant. One or more of these treatments is to reduce adhesion and/or cohesive forces to prevent occurrence of fin collapse.Type: ApplicationFiled: September 25, 2020Publication date: January 21, 2021Applicant: INTEL CORPORATIONInventors: Nabil G. Mistkawi, Glenn A. Glass
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Publication number: 20210013199Abstract: An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 11 nanometers, fin height is greater than 155 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 15 nanometers, fin height is greater than 190 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. A method for forming a fin-based transistor structure is provided where a plurality of fins on a substrate are pre-treated with at least one of a self-assembled monolayer, a non-polar solvent, and a surfactant. One or more of these treatments is to reduce adhesion and/or cohesive forces to prevent occurrence of fin collapse.Type: ApplicationFiled: September 25, 2020Publication date: January 14, 2021Applicant: INTEL CORPORATIONInventors: Nabil G. Mistkawi, Glenn A. Glass
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Patent number: 10833076Abstract: An integrated circuit device with a substrate and a plurality of fins is provided where the fin width is less than 11 nanometers, the fin height is greater than 155 nanometers and the spacing between any two neighboring fins is less than 30 nanometers and each of the fins is in a non-collapsed state. An integrated circuit device with a substrate and a plurality of fins is also provided where the fin width is less than 15 nanometers, the fin height is greater than 190 nanometers and the spacing between any two neighboring fins is less than 30 nanometers and each of the fins is in a non-collapsed state. A method for forming a fin-based transistor structure is also provided where a plurality of fins on a substrate are pre-treated with at least one of a self-assembled monolayer, a non-polar solvent, and a surfactant. One or more of these treatments is provided to reduce the adhesion and/or cohesive forces to prevent the occurrence of fin collapse.Type: GrantFiled: September 30, 2016Date of Patent: November 10, 2020Assignee: Intel CorporationInventors: Nabil G. Mistkawi, Glenn A. Glass
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Patent number: 10755984Abstract: Techniques are disclosed for customization of fin-based transistor devices to provide a diverse range of channel configurations and/or material systems, and within the same integrated circuit die. Sacrificial fins are removed via wet and/or dry etch chemistries configured to provide trench bottoms that are non-faceted and have no or otherwise low-ion damage. The trench is then filled with desired semiconductor material. A trench bottom having low-ion damage and non-faceted morphology encourages a defect-free or low defect interface between the substrate and the replacement material. In an embodiment, each of a first set of the sacrificial silicon fins is recessed and replaced with a p-type material, and each of a second set of the sacrificial fins is recessed and replaced with an n-type material. Another embodiment may include a combination of native fins (e.g., Si) and replacement fins (e.g., SiGe). Another embodiment may include replacement fins all of the same configuration.Type: GrantFiled: June 24, 2015Date of Patent: August 25, 2020Assignee: Intel CorporationInventors: Glenn A. Glass, Ying Pang, Nabil G. Mistkawi, Anand S. Murthy, Tahir Ghani, Huang-Lin Chao
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Publication number: 20200119003Abstract: An integrated circuit device with a substrate and a plurality of fins is provided where the fin width is less than 11 nanometers, the fin height is greater than 155 nanometers and the spacing between any two neighboring fins is less than 30 nanometers and each of the fins is in a non-collapsed state. An integrated circuit device with a substrate and a plurality of fins is also provided where the fin width is less than 15 nanometers, the fin height is greater than 190 nanometers and the spacing between any two neighboring fins is less than 30 nanometers and each of the fins is in a non-collapsed state. A method for forming a fin-based transistor structure is also provided where a plurality of fins on a substrate are pre-treated with at least one of a self-assembled monolayer, a non-polar solvent, and a surfactant. One or more of these treatments is provided to reduce the adhesion and/or cohesive forces to prevent the occurrence of fin collapse.Type: ApplicationFiled: September 30, 2016Publication date: April 16, 2020Applicant: INTEL CORPORATIONInventors: Nabil G. Mistkawi, Glenn A. Glass
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Patent number: 10541334Abstract: Techniques are disclosed for improved integration of germanium (Ge)-rich p-MOS source/drain contacts to, for example, reduce contact resistance. The techniques include depositing the p-type Ge-rich layer directly on a silicon (Si) surface in the contact trench location, because Si surfaces are favorable for deposition of high quality conductive Ge-rich materials. In one example method, the Ge-rich layer is deposited on a surface of the Si substrate in the source/drain contact trench locations, after removing a sacrificial silicon germanium (SiGe) layer previously deposited in the source/drain locations. In another example method, the Ge-rich layer is deposited on a Si cladding layer in the contact trench locations, where the Si cladding layer is deposited on a functional p-type SiGe layer. In some cases, the Ge-rich layer comprises at least 50% Ge (and may contain tin (Sn) and/or Si) and is boron (B) doped at levels above 1E20 cm?3.Type: GrantFiled: November 26, 2018Date of Patent: January 21, 2020Assignee: INTEL CORPORATIONInventors: Glenn A. Glass, Anand S. Murthy, Tahir Ghani, Ying Pang, Nabil G. Mistkawi
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Publication number: 20190221641Abstract: Techniques are disclosed for forming nanowire transistors employing carbon-based layers. Carbon is added to the sacrificial layers and/or non-sacrificial layers of a multilayer stack forming one or more nanowires in the transistor channel region. Such carbon-based layers reduce or prevent diffusion and intermixing of the sacrificial and non-sacrificial portions of the multilayer stack. The reduction of diffusion/intermixing can allow for the originally formed layers to effectively maintain their original thicknesses, thereby enabling the formation of relatively more nanowires for a given channel region height because of the more accurate processing scheme. The techniques can be used to benefit group IV semiconductor material nanowire devices (e.g., devices including Si, Ge, and/or SiGe) and can also assist with the selective etch processing used to form the nanowires.Type: ApplicationFiled: September 30, 2016Publication date: July 18, 2019Applicant: INTEL CORPORATIONInventors: Glenn A. Glass, Anand S. Murthy, Nabil G. Mistkawi, Karthik Jambunathan, Tahir Ghani
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Publication number: 20190214460Abstract: Techniques are disclosed for fabricating nanowire transistors using directional selective etching. Generally, a selective wet etch employing a given etchant can be used to remove at least one “select material” while not removing other material exposed to the etch (or removing that other material at a relatively slower rate). The techniques described herein expand upon such selective etch processing by including a directional component. A directional selective etch may include a selective etch that only (or primarily) removes the select material in a targeted direction and/or that discriminates against removal of material in a non-targeted direction.Type: ApplicationFiled: September 30, 2016Publication date: July 11, 2019Applicant: INTEL CORPORATIONInventors: Nabil G. Mistkawi, Glenn A. Glass
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Publication number: 20190109234Abstract: Techniques are disclosed for improved integration of germanium (Ge)-rich p-MOS source/drain contacts to, for example, reduce contact resistance. The techniques include depositing the p-type Ge-rich layer directly on a silicon (Si) surface in the contact trench location, because Si surfaces are favorable for deposition of high quality conductive Ge-rich materials. In one example method, the Ge-rich layer is deposited on a surface of the Si substrate in the source/drain contact trench locations, after removing a sacrificial silicon germanium (SiGe) layer previously deposited in the source/drain locations. In another example method, the Ge-rich layer is deposited on a Si cladding layer in the contact trench locations, where the Si cladding layer is deposited on a functional p-type SiGe layer. In some cases, the Ge-rich layer comprises at least 50% Ge (and may contain tin (Sn) and/or Si) and is boron (B) doped at levels above 1E20 cm?3.Type: ApplicationFiled: November 26, 2018Publication date: April 11, 2019Applicant: INTEL CORPORATIONInventors: GLENN A. GLASS, ANAND S. MURTHY, TAHIR GHANI, YING PANG, NABIL G. MISTKAWI
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Publication number: 20190019891Abstract: A trench is formed in an insulating layer to expose a native fin on a substrate. A replacement fin is deposited on the native fin in the trench. The replacement fin is trimmed laterally.Type: ApplicationFiled: March 30, 2016Publication date: January 17, 2019Inventors: Glenn A. GLASS, Anand S. MURTHY, Karthik JAMBUNATHAN, Chandra S. MOHAPATRA, Hei KAM, Nabil G. MISTKAWI, Jun Sung KANG, Biswajeet GUHA
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Patent number: 10147817Abstract: Techniques are disclosed for improved integration of germanium (Ge)-rich p-MOS source/drain contacts to, for example, reduce contact resistance. The techniques include depositing the p-type Ge-rich layer directly on a silicon (Si) surface in the contact trench location, because Si surfaces are favorable for deposition of high quality conductive Ge-rich materials. In one example method, the Ge-rich layer is deposited on a surface of the Si substrate in the source/drain contact trench locations, after removing a sacrificial silicon germanium (SiGe) layer previously deposited in the source/drain locations. In another example method, the Ge-rich layer is deposited on a Si cladding layer in the contact trench locations, where the Si cladding layer is deposited on a functional p-type SiGe layer. In some cases, the Ge-rich layer comprises at least 50% Ge (and may contain tin (Sn) and/or Si) and is boron (B) doped at levels above 1E20 cm?3.Type: GrantFiled: January 2, 2018Date of Patent: December 4, 2018Assignee: INTEL CORPORATIONInventors: Glenn A. Glass, Anand S. Murthy, Tahir Ghani, Ying Pang, Nabil G. Mistkawi
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Publication number: 20180197789Abstract: Techniques are disclosed for customization of fin-based transistor devices to provide a diverse range of channel configurations and/or material systems, and within the same integrated circuit die. Sacrificial fins are removed via wet and/or dry etch chemistries configured to provide trench bottoms that are non-faceted and have no or otherwise low-ion damage. The trench is then filled with desired semiconductor material. A trench bottom having low-ion damage and non-faceted morphology encourages a defect-free or low defect interface between the substrate and the replacement material. In an embodiment, each of a first set of the sacrificial silicon fins is recessed and replaced with a p-type material, and each of a second set of the sacrificial fins is recessed and replaced with an n-type material. Another embodiment may include a combination of native fins (e.g., Si) and replacement fins (e.g., SiGe). Another embodiment may include replacement fins all of the same configuration.Type: ApplicationFiled: June 24, 2015Publication date: July 12, 2018Applicant: INTEL CORPORATIONInventors: GLENN A. GLASS, YING PANG, NABIL G. MISTKAWI, ANAND S. MURTHY, TAHIR GHANI, HUANG-LIN CHAO
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Publication number: 20180145174Abstract: Techniques are disclosed for improved integration of germanium (Ge)-rich p-MOS source/drain contacts to, for example, reduce contact resistance. The techniques include depositing the p-type Ge-rich layer directly on a silicon (Si) surface in the contact trench location, because Si surfaces are favorable for deposition of high quality conductive Ge-rich materials. In one example method, the Ge-rich layer is deposited on a surface of the Si substrate in the source/drain contact trench locations, after removing a sacrificial silicon germanium (SiGe) layer previously deposited in the source/drain locations. In another example method, the Ge-rich layer is deposited on a Si cladding layer in the contact trench locations, where the Si cladding layer is deposited on a functional p-type SiGe layer. In some cases, the Ge-rich layer comprises at least 50% Ge (and may contain tin (Sn) and/or Si) and is boron (B) doped at levels above 1E20 cm?3.Type: ApplicationFiled: January 2, 2018Publication date: May 24, 2018Applicant: INTEL CORPORATIONInventors: GLENN A. GLASS, ANAND S. MURTHY, TAHIR GHANI, YING PANG, NABIL G. MISTKAWI
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Patent number: 9859424Abstract: Techniques are disclosed for improved integration of germanium (Ge)-rich p-MOS source/drain contacts to, for example, reduce contact resistance. The techniques include depositing the p-type Ge-rich layer directly on a silicon (Si) surface in the contact trench location, because Si surfaces are favorable for deposition of high quality conductive Ge-rich materials. In one example method, the Ge-rich layer is deposited on a surface of the Si substrate in the source/drain contact trench locations, after removing a sacrificial silicon germanium (SiGe) layer previously deposited in the source/drain locations. In another example method, the Ge-rich layer is deposited on a Si cladding layer in the contact trench locations, where the Si cladding layer is deposited on a functional p-type SiGe layer. In some cases, the Ge-rich layer comprises at least 50% Ge (and may contain tin (Sn) and/or Si) and is boron (B) doped at levels above 1E20 cm?3.Type: GrantFiled: March 21, 2014Date of Patent: January 2, 2018Assignee: INTEL CORPORATIONInventors: Glenn A. Glass, Anand S. Murthy, Tahir Ghani, Ying Pang, Nabil G. Mistkawi
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Publication number: 20170012124Abstract: Techniques are disclosed for improved integration of germanium (Ge)-rich p-MOS source/drain contacts to, for example, reduce contact resistance. The techniques include depositing the p-type Ge-rich layer directly on a silicon (Si) surface in the contact trench location, because Si surfaces are favorable for deposition of high quality conductive Ge-rich materials. In one example method, the Ge-rich layer is deposited on a surface of the Si substrate in the source/drain contact trench locations, after removing a sacrificial silicon germanium (SiGe) layer previously deposited in the source/drain locations. In another example method, the Ge-rich layer is deposited on a Si cladding layer in the contact trench locations, where the Si cladding layer is deposited on a functional p-type SiGe layer. In some cases, the Ge-rich layer comprises at least 50% Ge (and may contain tin (Sn) and/or Si) and is boron (B) doped at levels above 1E20 cm?3.Type: ApplicationFiled: March 21, 2014Publication date: January 12, 2017Applicant: INTEL CORPORATIONInventors: GLENN A. GLASS, ANAND S. MURTHY, TAHIR GHANI, YING PANG, NABIL G. MISTKAWI
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Patent number: 9472456Abstract: Methods for selectively etching titanium and titanium nitride are disclosed. In some embodiments the method involve exposing a workpiece to a first solution to remove titanium nitride, exposing the workpiece to a second solution to remove titanium, and exposing the workpiece to a third solution to remove residual titanium nitride, if any. The solutions are formulated such that they may selectively remove titanium and/or titanium nitride, while not etching or not substantially etching certain other materials such as dielectric materials, oxides, and metals other than titanium.Type: GrantFiled: December 24, 2013Date of Patent: October 18, 2016Assignee: Intel CorporationInventors: Erica J. Thompson, Nabil G. Mistkawi, Rohit Grover