Abstract: A TX/RX RF switch that may include a reception path; and a transmission path that has an antenna port, a transmission input port, and transmission transistors. The transmission transistors have source-bulk connections. The reception path has an antenna port, a reception output port, and reception transistors. The reception path includes a first reception transistor that is closest to the antenna port, out of the reception transistors, and has a source-bulk connection, and at least one other reception transistor that has a bulk-to-ground connection. The reception transistors and the transmission transistors are CMOS transistors.

Abstract: A novel and useful a single layer RFIC/MMIC structure including a package and related redistribution layer (RDL) based low loss grounded coplanar transmission line. The structure includes a package molded around an RF circuit die with a single redistribution layer (RDL) fabricated on the surface thereof mounted on an RF printed circuit board (PCB) via a plurality of solder balls. Coplanar transmission lines are fabricated on the RDL to conduct RF output signals from the die to PCB signal solder balls. The signal trace transition to the solder balls are funnel shaped to minimize insertion loss and maximize RF isolation between channels. A conductive ground shield is fabricated on the single RDL and operative to shield the plurality of coplanar transmission lines.

Abstract: A novel and useful a single layer RFIC/MMIC structure including a package and related redistribution layer (RDL) based low loss grounded coplanar transmission line. The structure includes a package molded around an RF circuit die with a single redistribution layer (RDL) fabricated on the surface thereof mounted on an RF printed circuit board (PCB) via a plurality of solder balls. Coplanar transmission lines are fabricated on the RDL to conduct RF output signals from the die to PCB signal solder balls. The signal trace transition to the solder balls are funnel shaped to minimize insertion loss and maximize RF isolation between channels. A conductive ground shield is fabricated on the single RDL and operative to shield the plurality of coplanar transmission lines.

Abstract: A TX/RX RF switch that may include a reception path; and a transmission path that has an antenna port, a transmission input port, and transmission transistors. The transmission transistors have source-bulk connections. The reception path has an antenna port, a reception output port, and reception transistors. The reception path includes a first reception transistor that is closest to the antenna port, out of the reception transistors, and has a source-bulk connection, and at least one other reception transistor that has a bulk-to-ground connection. The reception transistors and the transmission transistors are CMOS transistors.

Abstract: An integrated circuit RF power amplifier that includes a substrate; a low power (LP) amplifier; a high-power (HP) amplifier; and an asymmetrical parallel-combining transformer. The substrate is configured to supports the LP amplifier, the HP amplifier and the asymmetrical parallel-combining transformer. The LP amplifier is configured to amplify a LP RF input signal to provide a LP amplified signal. The HP amplifier is configured to amplify a HP RF input signal to provide a HP amplified signal. The HP amplified signal has maximal intensity that exceeds a maximal intensity of the LP amplified signal.

Abstract: An integrated circuit RF power amplifier that includes a substrate; a low power (LP) amplifier; a high-power (HP) amplifier; and an asymmetrical parallel-combining transformer. The substrate is configured to supports the LP amplifier, the HP amplifier and the asymmetrical parallel-combining transformer. The LP amplifier is configured to amplify a LP RF input signal to provide a LP amplified signal. The HP amplifier is configured to amplify a HP RF input signal to provide a HP amplified signal. The HP amplified signal has maximal intensity that exceeds a maximal intensity of the LP amplified signal.