Abstract: A process for forming CMOS devices uses outdiffusion of implanted ions in a patterned refractory silicidable layer to form the source/drain regions of the device. Moreover, the oxidation of the sidewalls of openings formed in the layer serves to isolate the layer from the polysilicon gate electrode which is later formed in the openings in this layer.

Abstract: A process for forming MOS transistors in which the source and drain regions essentially interface only the channel portion of the silicon substrate to keep parasitic capacitances low. To this end, a monocrystalline silicon substrate has one major planar surface covered with a layer of silicon oxide and a hole formed in the oxide layer of a size suited for the channel of the transistor. Then silicon is epitaxially grown vertically to fill the hole. The grown silicon is then covered. Next, portions of the oxide layer are removed to expose a pair of opposed vertical sidewalls of the vertically grown silicon and silicon is epitaxially grown laterally out of said exposed sidewalls. Such laterally grown regions serve as the source and drain of the transistor and an upper portion of the vertically grown silicon serves as the channel. A gate oxide is grown over a top portion of the vertically grown silicon and a polysilicon gate region is formed over the gate oxide.