Abstract: An integrated circuit for a high speed data communication system with improved Electrostatic Discharge (ESD) protection is provided. The circuit includes first and second monolithic transformers. An ESD device connected between the first and second monolithic transformers. There are first and second on-chip spark gaps for forming low impedance grounds during ESD events. The first on-chip spark gaps are electrically connected to the first monolithic transformer and the second on-chip spark gaps are electrically connected to the second monolithic transformer.

Abstract: An electronic circuit component mounting system for mounting electronic circuit components on a substrate for an electronic circuit component having an electrically conductive bonding pad on an interconnection surface thereof and a substrate having a trace supporting surface with an electrically conductive trace thereon. The interconnections between the traces and pads are formed so that they differ in shape or position, or both, along the lengths thereof as positioned over a conductive layer, but adjacent pairs used to carry differential signals may not be positioned over such a layer.