Abstract: A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

Abstract: A heat exchanger for cooling a component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Abstract: A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

Abstract: A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

Abstract: A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.

Abstract: A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.

Abstract: A heat exchanger for cooling a component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Abstract: A circuit breaker or conductor severing assembly can include a housing with a conductor extending through the housing. A piston disposed within the interior of the housing can be actuable within the housing between a first position and a second position, driven by a volume expansion composition. The piston can include a cutter, such that actuation to the second position can sever the conductor extending through the housing.

Abstract: A heat exchanger for cooling an electronic component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Abstract: A heat exchanger for cooling an electronic component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Abstract: A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

Abstract: A method of reducing whisker growths includes identifying a solder connection to be treated. The solder connection may contain one or more whisker growths. A heat source is applied at a defined temperature to the solder connection for a defined period of time sufficient to melt at least a portion of the one or more whisker growths. The heat source is removed from the solder connection prior to the melting of the solder connection.

Abstract: A closed loop air handling system for monitoring and cleaning air from corrosive contaminants. Commonly occurring corrosive elements found in air can react in combination together and with other environmental conditions to increase the propensity for corrosion to occur. The higher corrosive level of air can react with metals causing degradation, wear and often lead to premature failure. This is especially prevalent in environments using forced air convection for cooling, such as data centers. The electronic circuitry is especially vulnerable to such corrosion and requires an environmentally controlled atmosphere with mild corrosiveness for long term reliability. The invention involves circulating the air in a closed loop and monitors and adjusts parameters of active filtration and purification to minimize corrosive agents. The system maintains a milder corrosive environment and better accommodates the use of “free cooling” from outside air for improved energy efficiency and lower carbon emissions.