Abstract: Systems and methods consistent with principles of the present invention alow contactless measuring of various kinds of electrical activity within an integrated circuit. The invention can be used for high-bandwidth, at speed testing of various devices on a wafer during the various stages of device processing, or on packaged parts at the end of the manufacturing cycle. Power is applied to the test circuit using conventional mechanical probes or other means, such as CW laser light applied to a photoreceiver provided on the test circuit. The electrical test signal is introduced into the test circuit by stimulating the circuit using a contactless method, such as by directing the output of one or more modelocked lasers onto high-speed receivers on the circuit, or by using a high-speed pulsed diode laser.

Abstract: A bi-convex solid immersion lens is disclosed. Unlike conventional plano-convex solid immersion lenses having a flat bottom surface, the disclosed lens has a convex bottom surface. The radius of curvature of the bottom surface is smaller than that of the object to be inspected. This construction allows for a more accurate determination of the location of the inspected feature, and enhances coupling of light between the immersion lens and the inspected object. The disclosed lens is particularly useful for use in microscope for inspection of semiconductor devices and, especially flip-chip (or chip scale) packaged devices. The immersion lens can also be incorporated in a read or read/write head of optical memory media.

Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).