Abstract: Various aspects of the present invention provide an apparatus and a method of removing an orthopedic implant from a patient. In one embodiment, the method includes cycling the temperature of at least a portion of the orthopedic implant between a first temperature and a second temperature that differs from the first temperature. In one embodiment, the first temperature is above 0° C. and the second temperature is below 0° C. The temperature cycling causes a thermal expansion differential between at least a portion of the orthopedic implant and material in a region contacting the orthopedic implant. In one embodiment, the thermal expansion differential is of an extent sufficient to cause physical separation of at least a portion of the surface of the orthopedic implant from material contacting the surface of the orthopedic implant.

Abstract: Described herein is a method for treating or prophylaxis of adverse immune reaction to metal debris, metal induced delayed type hypersensitivity (DTH), or inflammatory osteolysis by attenuating the inflammatory response. In one aspect, the method involves inhibiting the nucleotide-binding domain (NOD)-like receptor protein 3 (NLRP3) inflammasome/caspase-1 pathway or neutralizing or blocking the activity of interleukin 17 (IL-17), IL-17 receptor (IL-17R), IL-1R, IL-1?, IL-18, IL-21, IL-23 with anti-IL-17, anti-IL-17A, anti-IL-17F, anti-IL-17A/F, anti-IL-1, anti-IL-1?, anti-IL-18, anti-IL-21, anti-IL-23, anti-IL-1R, soluble IL-17 receptors, soluble IL-1 receptors, soluble IL-18 receptors, soluble IL-21 receptors, IL-17 receptor inhibitors, IL-1 receptor inhibitors, IL-18 receptor inhibitors, IL-21 receptor inhibitors, IL-23 receptor inhibitors, blocking agents, inflammasome inhibitors, or combinations thereof.

Abstract: Described herein is a method for treating or prophylaxis of adverse immune reaction to metal debris, metal induced delayed type hypersensitivity (DTH), or inflammatory osteolysis by attenuating the inflammatory response. In one aspect, the method involves inhibiting the nucleotide-binding domain (NOD)-like receptor protein 3 (NLRP3) inflammasome/caspase-1 pathway or neutralizing or blocking the activity of interleukin 17 (IL-17), IL-17 receptor (IL-17R), IL-1R, IL-1(3, IL-18, IL-21, IL-23 with anti-IL-17, anti-IL-17A, anti-IL-17F, anti-IL-17A/F, anti-IL-1, anti-IL-1?, anti-IL-18, anti-IL-21, anti-IL-23, anti-IL-1R, soluble IL-17 receptors, soluble IL-1 receptors, soluble IL-18 receptors, soluble IL-21 receptors, IL-17 receptor inhibitors, IL-1 receptor inhibitors, IL-18 receptor inhibitors, IL-21 receptor inhibitors, IL-23 receptor inhibitors, blocking agents, inflammasome inhibitors, or combinations thereof.

Abstract: Various aspects of the present invention provide an apparatus and a method of removing an orthopedic implant from a patient. In one embodiment, the method includes cycling the temperature of at least a portion of the orthopedic implant between a first temperature and a second temperature that differs from the first temperature. In one embodiment, the first temperature is above 0° C. and the second temperature is below 0° C. The temperature cycling causes a thermal expansion differential between at least a portion of the orthopedic implant and material in a region contacting the orthopedic implant. In one embodiment, the thermal expansion differential is of an extent sufficient to cause physical separation of at least a portion of the surface of the orthopedic implant from material contacting the surface of the orthopedic implant.

Abstract: Various aspects of the present invention provide an apparatus and a method of removing an orthopedic implant from a patient. In one embodiment, the method includes cycling the temperature of at least a portion of the orthopedic implant between a first temperature and a second temperature that differs from the first temperature. In one embodiment, the first temperature is above 0° C. and the second temperature is below 0° C. The temperature cycling causes a thermal expansion differential between at least a portion of the orthopedic implant and material in a region contacting the orthopedic implant. In one embodiment, the thermal expansion differential is of an extent sufficient to cause physical separation of at least a portion of the surface of the orthopedic implant from material contacting the surface of the orthopedic implant.

Abstract: Various aspects of the present invention provide an apparatus and a method of removing an orthopedic implant from a patient. In one embodiment, the method includes cycling the temperature of at least a portion of the orthopedic implant between a first temperature and a second temperature that differs from the first temperature. In one embodiment, the first temperature is above 0° C. and the second temperature is below 0° C. The temperature cycling causes a thermal expansion differential between at least a portion of the orthopedic implant and material in a region contacting the orthopedic implant. In one embodiment, the thermal expansion differential is of an extent sufficient to cause physical separation of at least a portion of the surface of the orthopedic implant from material contacting the surface of the orthopedic implant.

Abstract: The present invention generally relates to systems and methods of treating microbial growth on a conducting surface, for example, the conducting surface of an implanted medical device. One embodiment of the method includes applying a electrical current through the conducting surface and a counter electrode. The electrical current is varied such that an electrical potential of the conducting surface alternates compared to the electrical potential of a reference electrode and where the electrical current is varied to an extent sufficient to reduce or prevent microbial growth on the conducting surface.