Patents by Inventor Nadja ERDNER

Nadja ERDNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9159639
    Abstract: A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: October 13, 2015
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Kurt-Georg Besendörfer, Nadja Erdner, Jürgen Steger
  • Publication number: 20130176682
    Abstract: A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.
    Type: Application
    Filed: July 9, 2012
    Publication date: July 11, 2013
    Applicant: Semikron Elektronik GmbH & Co., KG
    Inventors: Kurt-Georg BESENDÖRFER, Nadja ERDNER, Jürgen STEGER