Patents by Inventor Nag Patibandla

Nag Patibandla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220406960
    Abstract: Exemplary processing methods include forming a group of LED structures on a substrate layer to form a patterned LED substrate. A light absorption barrier may be deposited on the patterned LED substrate. The methods may further include exposing the patterned LED substrate to light. The light may be absorbed by surfaces of the LED structures that are in contact with the substrate layer, and the light absorption barrier. The methods may still further include separating the LED structures for the substrate layer. The bonding between the LED structures and the substrate layer may be weakened by the absorption of the light by the surfaces of the LED structures in contact with the substrate layer.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Fabio Pieralisi, Mingwei Zhu, Zihao Yang, Liang Zhao, Jeffrey L. Franklin, Hou T. Ng, Nag Patibandla
  • Publication number: 20220399474
    Abstract: Exemplary processing methods of forming an LED structure may include depositing an aluminum nitride layer on a substrate via a physical vapor deposition process. The methods may include heating the aluminum nitride layer to a temperature greater than or about 1500° C. The methods may include forming an ultraviolet light emitting diode structure overlying the aluminum nitride layer utilizing a metal-organic chemical vapor deposition or molecular beam epitaxy.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 15, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Zihao Yang, Mengnan Zou, Mingwei Zhu, David Masayuki Ishikawa, Nag Patibandla
  • Publication number: 20220399479
    Abstract: Methods of making high-pixel-density LED structures are described. The methods may include forming a backplane substrate and a LED substrate. The backplane substrate and the LED substrate may be bonded together, and the bonded substrates may include an array of LED pixels. Each of the LED pixels may include a group of isolated subpixels. A quantum dot layer may be formed on at least one of the isolated subpixels in each of the LED pixels. The methods may further include repairing at least one defective LED pixel by forming a replacement quantum dot layer on a quantum-dot-layer-free subpixel in the defective LED pixel. The methods may also include forming a UV barrier layer on the array of LED pixels after the repairing of the at least one defective LED pixel.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 15, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Lisong Xu, Mingwei Zhu, Byung Sung Kwak, Hyunsung Bang, Liang Zhao, Hou T. Ng, Sivapackia Ganapathiappan, Nag Patibandla
  • Publication number: 20220302339
    Abstract: Exemplary processing methods of forming an LED structure on a backplane may include coupling a first transfer substrate with an LED source substrate. The LED source substrate may include a plurality of fabricated LEDs. The coupling of the first transfer substrate may be produced with a first coupling material extending between the first transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the LED source substrate from the LEDs. The methods may include coupling a second transfer substrate with the first transfer substrate. The coupling of the first transfer substrate may be produced with a second coupling material extending between the second transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the first transfer substrate from the second transfer substrate. The methods may include bonding the plurality of fabricated LEDs with a display backplane.
    Type: Application
    Filed: February 14, 2022
    Publication date: September 22, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Hou T. Ng, Nag Patibandla, Uma Sridhar, Sivapackia Ganapathiappan, Mingwei Zhu
  • Publication number: 20220149250
    Abstract: Exemplary pixel structures may include a pixel structure of a display device panel stack. The structures may include a first panel. The first panel may include a plurality of ultraviolet light sources disposed on a backplane. The structures may also include a second panel. The second panel may be coupled with the first panel. The second panel may have an inner surface facing the ultraviolet light sources. The second panel may include a transparent substrate and a down-conversion layer. The down-conversion layer may be disposed overlying the transparent substrate. The down-conversion layer may be configured to down-convert ultraviolet light into visible light. The plurality of ultraviolet light sources and the inner surface of the second panel may be separated by a distance of at least 2 ?m.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 12, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Robert Anthony Nordsell, Mingwei Zhu, Nag Patibandla, John D. Busch, Moon Young Shin, Asha Parekh, Hou T. Ng
  • Patent number: 9478697
    Abstract: In some embodiments, a substrate carrier for holding a plurality of substrates comprises a disk formed of a continuous material to a nominal dimension which is approximately a multiple of a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices. In an embodiment, the disk is formed symmetrically about a central axis and defines a substantially planar upper surface. A first pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the first pair of pockets are bisected by a first reference plane passing through the central axis. A second pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the second pair of pockets are bisected by a second reference plane passing through the central axis.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: October 25, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sriskantharajah Thirunavukarasu, Mingwei Zhu, Karthik Elumalai, Thean Ming Tan, Yong Cao, Daniel Lee Diehl, Nag Patibandla
  • Publication number: 20160133781
    Abstract: In some embodiments, a substrate carrier for holding a plurality of substrates comprises a disk formed of a continuous material to a nominal dimension which is approximately a multiple of a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices. In an embodiment, the disk is formed symmetrically about a central axis and defines a substantially planar upper surface. A first pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the first pair of pockets are bisected by a first reference plane passing through the central axis. A second pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the second pair of pockets are bisected by a second reference plane passing through the central axis.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 12, 2016
    Inventors: SRISKANTHARAJAH THIRUNAVUKARASU, Mingwei Zhu, Karthik Elumalai, Thean Ming Tan, Yong Cao, Daniel Lee Diehl, Nag Patibandla