Patents by Inventor Naganori HIRAKAWA

Naganori HIRAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRONIC COMPONENT
    Publication number: 20230317538
    Abstract: An electronic component includes a plurality of laminated insulating layers, one or more surface conductors formed on a surface of the insulating layer, and an internal conductor formed at a boundary portion between the adjacent insulating layers. A thickness of the surface conductor is larger than a thickness of a thinnest layer of the insulating layers and larger than a thickness of the internal conductor.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 5, 2023
    Inventor: Naganori HIRAKAWA
  • Electronic component and manufacturing method for the same
    Patent number: 11398342
    Abstract: An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: July 26, 2022
    Assignee: MURATA MANUFACTURING CO., LTD
    Inventors: Jun Adachi, Naganori Hirakawa, Hiroyuki Asano, Sumiyo Nakamura
  • ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME
    Publication number: 20190244749
    Abstract: An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 8, 2019
    Inventors: Jun ADACHI, Naganori HIRAKAWA, Hiroyuki ASANO, Sumiyo NAKAMURA