Patents by Inventor Nageswara Rao Bonda

Nageswara Rao Bonda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging process to create wettable lead flank during board assembly
    Patent number: 8329509
    Abstract: A method and apparatus are described for fabricating a low-pin-count chip package (701) including a die pad (706) for receiving an integrated circuit device and a plurality of connection leads (702) having recessed lead ends (704) at the outer peripheral region of each contact lead. After forming the package body (202) over the integrated circuit device, unplated portions (104) of the exposed bottom surface of the selectively plated lead frame are partially etched to form recessed lead ends (302) at the outer peripheral region of each contact lead, and the recessed lead ends are subsequently re-plated (402) to provide wettable recessed lead ends at the outer peripheral region of each contact lead.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: December 11, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Zhiwei Gong, Nageswara Rao Bonda, Wei Gao, Jinsheng Wang, Dehong Ye
  • Packaging Process to Create Wettable Lead Flank During Board Assembly
    Publication number: 20110244629
    Abstract: A method and apparatus are described for fabricating a low-pin-count chip package (701) including a die pad (706) for receiving an integrated circuit device and a plurality of connection leads (702) having recessed lead ends (704) at the outer peripheral region of each contact lead. After forming the package body (202) over the integrated circuit device, unplated portions (104) of the exposed bottom surface of the selectively plated lead frame are partially etched to form recessed lead ends (302) at the outer peripheral region of each contact lead, and the recessed lead ends are subsequently re-plated (402) to provide wettable recessed lead ends at the outer peripheral region of each contact lead.
    Type: Application
    Filed: April 1, 2010
    Publication date: October 6, 2011
    Inventors: Zhiwei Gong, Nageswara Rao Bonda, Wei Gao, Jinsheng Wang, Dehong Ye