Patents by Inventor Nagib Ward

Nagib Ward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BIOMASS TRANSFORMATION
    Publication number: 20170009257
    Abstract: The present invention provides improved methods of transforming biomass using Deinococcus bacteria.
    Type: Application
    Filed: February 13, 2015
    Publication date: January 12, 2017
    Inventors: FABIEN COZE, NAGIB WARD, ASSIA DREUXZIGHA, CLARINE LAZZARELLI, JEAN-PAUL LEONETTI
  • Adhesively securable stock materials
    Publication number: 20060240257
    Abstract: Stock materials for manual and/or high speed industrial automated bonding applications having a curable pre-applied adhesive or sealant compositions on the bonding surfaces wherein the curative for the pre-applied adhesive or sealant composition is contained within a carrier which prevents its premature release.
    Type: Application
    Filed: February 28, 2006
    Publication date: October 26, 2006
    Inventors: Todd Schwantes, Michael Krzoska, Gregory Kulibert, Adam Malofsky, Bernard Malofsky, Nagib Ward
  • Adhesively securable stock packaging materials
    Publication number: 20060228552
    Abstract: Stock packaging materials for manual and/or high speed industrial automated package formation and/or filing and closing applications having a curable pre-applied adhesive compositions applied to one or more seams or closure surfaces wherein the curative for the pre-applied adhesive composition is contained within a carrier which prevents its premature release.
    Type: Application
    Filed: February 28, 2006
    Publication date: October 12, 2006
    Inventors: Todd Schwantes, Michael Krzoska, Gregory Kulibert, Adam Malofsky, Bernard Malofsky, Nagib Ward
  • Encapsulated cure systems
    Publication number: 20060073334
    Abstract: Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive systems incorporating said encapsulated cure systems.
    Type: Application
    Filed: August 31, 2005
    Publication date: April 6, 2006
    Inventors: Todd Schwantes, Michael Krzoska, Gregory Kulibert, Adam Malofsky, Bernard Malofsky, Nagib Ward