Abstract: A production line includes a centralized cleaning/drying station for cleaning a wafer by using an HF cleaning solution or a non-HF cleaning solution and subsequently drying the wafer based on the desired cleaning/drying conditions, and a transport system for transporting the wafer between each processing station and the centralized cleaning/drying station. The production line has a large flexibility for selecting the cleaning/drying conditions for the wafer with a reduced system size.

Abstract: In a semiconductor device manufacturing line, a wet process unit area is located at a substantial center of the manufacturing line and is provided with concentratedly arranged wet process units. A plurality of processing unit areas are located around the wet process unit area. A plurality of direct transfer mechanisms for transferring products are arranged between the wet process unit area and the respective processing unit areas, and an area transfer mechanism for transferring products is arranged among the processing unit areas.

Abstract: A semiconductor fabrication line for fabricating a semiconductor device, which has: a mainstream line for conducting a semiconductor fabrication process to fabricate the semiconductor device; and an isolation line disposed separated from the mainstream line in the semiconductor fabrication line. The isolation line is provided for, of the semiconductor fabrication process, a contamination-including semiconductor fabrication process that a contamination causing material which may cause a contamination of the mainstream line appears on the surface of a wafer, and after processing the contamination causing material to be eliminated from the surface of the wafer in the isolation line, the wafer is returned from the isolation line to the mainstream line.

Abstract: In a wet processing apparatus, an electrolytic cell, a first storing cell for storing anode active water of the electrolytic cell, a first processing cell for processing a target with the anode active water of the first storing cell, a second storing cell for storing cathode active water of the electrolytic cell, and a second processing cell for processing a target with the cathode active water of the second storing cell are provided. Also, a first reactivating feedback path is provided between the first processing cell and an anode region of the electrolytic cell, and a second reactivating feedback path is provided between the second processing cell and a cathode region of the electrolytic cell.