Patents by Inventor Nai-Cheng Chou

Nai-Cheng Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200201032
    Abstract: An image pickup device includes a camera module and an automatic cleaning assembly. The automatic cleaning assembly includes a first rotation structure, a second rotation structure and a motive power source. A first end of a light-transmissible film is connected with the first rotation structure. A second end of the light-transmissible film is connected with the second rotation structure. The motive power source drives the rotation of at least one of the first rotation structure and the second rotation structure. As the at least one of the first rotation structure and the second rotation structure is rotated, the light-transmissible film is correspondingly moved. Consequently, the front side of the camera module is covered by a clean segment of the light-transmissible film.
    Type: Application
    Filed: March 22, 2019
    Publication date: June 25, 2020
    Inventors: Chiao-Lin Chang, Wen-Pin Hsieh, Yi-Ching Tsai, Nai-Cheng Chou
  • Patent number: 10139585
    Abstract: A processing process of a multi-lens camera module includes the following steps. Firstly, a first lens module and a first photosensitive element are installed on a first circuit board, and the first circuit board is fixed on a casing. Then, a second lens module and a second photosensitive element are installed on a second circuit board, and a bottom glue is coated on a lower portion of the second lens module. Then, the second lens module is adhered onto the casing through the bottom adhesive. After an optical axis parallel adjustment process is performed, the second lens module is in parallel with the first lens module. Then, a top glue is coated on an upper portion of the second lens module. After a baking process is performed, the top glue and the bottom glue are cured completely.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 27, 2018
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Nai-Cheng Chou, Chin-Chuan Wu