Patents by Inventor Nai-Wei Chang

Nai-Wei Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153887
    Abstract: A semiconductor package structure includes a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure, a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, a second electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are separated by a molding material, a first hole and a second hole formed on the second surface of the base, and a frame disposed over the first surface of the base, wherein the frame surrounds the first electronic component and the second electronic component.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Tzu-Hung LIN, Chia-Cheng CHANG, I-Hsuan PENG, Nai-Wei LIU
  • Patent number: 11948895
    Abstract: A semiconductor package structure includes a substrate having a wiring structure. A first semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure. A second semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged side-by-side. Holes are formed on a surface of the substrate, wherein the holes are located within a projection of the first semiconductor die or the second semiconductor die on the substrate. Further, a molding material surrounds the first semiconductor die and the second semiconductor die, and surfaces of the first semiconductor die and the second semiconductor die facing away from the substrate are exposed by the molding material.
    Type: Grant
    Filed: July 4, 2022
    Date of Patent: April 2, 2024
    Assignee: MEDIATEK INC.
    Inventors: Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu
  • Patent number: 10417416
    Abstract: A behavior of a computer security threat is described in a root-cause chain, which is represented by a detection rule. The detection rule includes the objects of the root-cause chain and computer operations that represent links of the root-cause chain. An endpoint computer establishes a link between objects described in the detection rule when a corresponding computer operation between the objects is detected. Detected computer operations are accumulated to establish the links between objects. The threat is identified to be in the computer when the links of the detection rule have been established.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 17, 2019
    Assignee: TREND MICRO INCORPORATED
    Inventors: Sheng Che Chang, Chun Wen Chang, Nai-Wei Chang, Meng-Che Lee
  • Patent number: 10061921
    Abstract: A behavior of a computer security threat is described in a root-cause chain, which is represented by a detection rule. The detection rule includes the objects of the root-cause chain and computer operations that represent links of the root-cause chain. An endpoint computer establishes a link between objects described in the detection rule when a corresponding computer operation between the objects is detected. Detected computer operations are accumulated to establish the links between objects. The threat is identified to be in the computer when the links of the detection rule have been established.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: August 28, 2018
    Assignee: Trend Micro Incorporated
    Inventors: Sheng Che Chang, Chun Wen Chang, Nai-Wei Chang, Meng-Che Lee