Abstract: A semiconductor package structure includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a passivation layer on the semiconductor substrate and the conductive pad. The passivation layer exposes a portion of the top surface of the conductive pad. The semiconductor package structure also includes a conductive adhesive layer on the conductive pad, and a dielectric layer on the passivation layer and the conductive adhesive layer. The dielectric layer exposes a portion of the conductive adhesive layer. The semiconductor package structure also includes a redistribution layer (RDL) structure on the dielectric layer and electrically connected to the conductive pad through the conductive adhesive layer. The semiconductor package structure also includes a bump structure over the RDL structure.

Abstract: Aspects of the disclosure provide a method. The method includes forming a structure over a substrate, and forming a spacer layer on the structure, wherein the spacer layer has a recess. The method includes forming a mask layer over the spacer layer and in the recess, the mask layer including a first layer, a second layer and a third layer. The method includes patterning the third layer of the mask layer, and etching the first layer and the second layer of the mask layer to form an opening to expose the recess of the spacer layer, wherein the opening in the second layer has a first width; and. The method includes removing the second layer using a wet etchant, wherein the opening in the third layer has a second width, and the second with is greater than the first width.

Abstract: An array checker (AC) is described. The array checker may include software configured to implement a method. By implementing the method, the array checker may detect a location of a defect and then compensate for a shift in the defect. In particular, the method may include generating one or more reference lines in a panel. The reference lines may include a location which is known prior to generating an image of the panel. The array checker may then capture an image of the panel. The image may be captured by voltage imaging. The image may include the defect and the one or more reference lines. The method may then include calculating an offset of the reference line from the known location. The offset may then be applied to the defect location for compensating the shift in the defect.