Abstract: A patterned curviform surface of glass includes a glass body having a smooth surface. The smooth surface has a plurality of compressive stress area, and the plurality of compressive stress area forms a predetermined pattern. Compressive stress retained in the compressive stress area is lager than 50 Mpa so that the plurality of compressive stress area will form a patterned curviform surface based on the predetermined pattern. A method for manufacturing the patterned curviform surface of glass includes forming a mask onto the smooth surface of surface roughness lower than 0.12 ?m. The mask includes a plurality of hollow, and the plurality of hollow forms a predetermined pattern. The smooth surface is processed by a chemical ion tempering process to form a plurality of compressive stress area retaining compressive stress within the hollow of the mask. By removing the mask and cleaning the smooth surface, a curviform surface opposite to the predetermined pattern is formed to the smooth surface.

Abstract: A method for manufacturing a patterned layer of compressive stress on a glass substrate includes forming a mask having predetermined pattern on a surface of the glass substrate. The pattern includes a plurality of hollow area and a shelter area The glass substrate is tempered by a chemical tempering process to form a layer retaining compressive stress on the uncovered area of the glass substrate surface so that the patterned layer of compressive stress is formed on the surface of the glass substrate. The patterned layer is formed to at least one surface of the glass substrate. The patterned layer has a plurality of area retaining different surface compressive stress. The patterned layer includes high stress areas separated by a low stress area. The surface compressive stress difference between the areas is larger than 100 MPa, or the depth difference between the areas is larger than 5 ?m.

Abstract: A glass substrate having a patterned layer of compressive stress on a surface thereof includes a patterned layer of compressive stress on at least one surface thereof. The patterned layer has a plurality of area of different surface compressive stress. The patterned layer includes high stress areas separated by a low stress area. The surface compressive stress difference between the areas is larger than 100 MPa, or the depth difference of the areas is larger than 5 ?m. The depth of compressive stressed layer is less than 20 ?m, and the compressive stress is lower than 400 MPa. The depth of compressive stressed layer is between 5 ?m to 90 ?m, and the compressive stress is between 100 MPa to 800 MPa. The strength of glass substrate in the high stress area will be improved, and the low stress area of the glass substrate still remains well capability for performing cutting, splitting, or grinding.