Abstract: A temperature sensor and device and system including same, comprise a switched capacitor circuit configured to generate a noise voltage in response to switching and circuitry configured to generate a relative temperature output signal proportional to an absolute temperature output signal in response to the noise voltage. The device includes a temperature sensor, temperature sensitive device logic and temperature compensation logic configured to receive the absolute temperature and generate an adjustment signal to adapt the temperature sensitive device logic in response thereto. A related method for sensing temperature includes amplifying a noise voltage from a switched capacitor circuit in a plurality of parallel amplifier channels and removing amplifier noise from each of the plurality of parallel amplifier channels to form a relative output signal proportional to an absolute temperature.

Abstract: An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. During an integration period, incident light causes electrons to be accumulated inside the buried accumulation region. The resistance characteristic of the channel region changes in response to a field created by the charges accumulated in the accumulation region. Thus, when a voltage is applied to one side of the channel, the current read out from the other side is characteristic of the amount of stored charges.

Abstract: An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. During an integration period, incident light causes electrons to be accumulated inside the buried accumulation region. The resistance characteristic of the channel region changes in response to a field created by the charges accumulated in the accumulation region. Thus, when a voltage is applied to one side of the channel, the current read out from the other side is characteristic of the amount of stored charges.

Abstract: A temperature sensor and device and system including same comprise a switched capacitor circuit configured to generate a noise voltage in response to switching and circuitry configured to generate a relative temperature output signal proportional to an absolute temperature output signal in response to the noise voltage. The device includes a temperature sensors temperature sensitive device logic and temperature compensation logic configured to receive the absolute temperature and generate an adjustment signal to adapt the temperature sensitive device logic in response thereto. A related method for sensing temperature includes amplifying a noise voltage from a switched capacitor circuit in a plurality of parallel amplifier channels and removing amplifier noise from each of the plurality of parallel amplifier channels to form a relative output signal proportional to an absolute temperature.

Abstract: An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. During an integration period, incident light causes electrons to be accumulated inside the buried accumulation region. The resistance characteristic of the channel region changes in response to a field created by the charges accumulated in the accumulation region. Thus, when a voltage is applied to one side of the channel, the current read out from the other side is characteristic of the amount of stored charges.

Abstract: An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. During an integration period, incident light causes electrons to be accumulated inside the buried accumulation region. The resistance characteristic of the channel region changes in response to a field created by the charges accumulated in the accumulation region. Thus, when a voltage is applied to one side of the channel, the current read out from the other side is characteristic of the amount of stored charges.

Abstract: An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. During an integration period, incident light causes electrons to be accumulated inside the buried accumulation region. The resistance characteristic of the channel region changes in response to a field created by the charges accumulated in the accumulation region. Thus, when a voltage is applied to one side of the channel, the current read out from the other side is characteristic of the amount of stored charges.

Abstract: An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. During an integration period, incident light causes electrons to be accumulated inside the buried accumulation region. The resistance characteristic of the channel region changes in response to a field created by the charges accumulated in the accumulation region. Thus, when a voltage is applied to one side of the channel, the current read out from the other side is characteristic of the amount of stored charges.