Patents by Inventor Naima WANG

Naima WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adjustable clamp finger design
    Patent number: 12459082
    Abstract: Implementations of a clamp finger may include a first portion including at least one tip configured to clamp a substrate against an anvil during a bonding operation; and a second portion including a first opening therethrough configured to permit coupling of the second portion with a clamping bridge. The first portion may be slidably coupled with the second portion through a rail and the first portion may include an opening therethrough configured to receive a screw that fixedly couples the at least one tip of the first portion at a desired position relative to the second portion.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: November 4, 2025
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Sen Sun, Kun Feng, Hu Cheng, Naima Wang
  • WIREBONDING SYSTEMS AND RELATED METHODS
    Publication number: 20250336880
    Abstract: An anvil for a wirebonding system may include a stationary substrate having a top working surface; and a first layer fixedly coupled to the top working surface of the stationary substrate for receiving a workpiece, the first layer configured to accommodate a warped surface of the workpiece during a bonding operation.
    Type: Application
    Filed: April 24, 2024
    Publication date: October 30, 2025
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Naima WANG, Sen SUN, Kun FENG, LianYan WU, ZhiNan LI
  • FIDUCIAL DESIGNS AND RELATED METHODS FOR WIRE BOND PATTERN RECOGNITION
    Publication number: 20250279371
    Abstract: Implementations of a semiconductor device may include a first die pad having a first metal layer thereon; and a fiducial for aligning to the semiconductor device, the fiducial including a portion including a photodefinable material formed over the first metal layer of the first die pad.
    Type: Application
    Filed: March 4, 2024
    Publication date: September 4, 2025
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Naima WANG, Sen SUN, Ian Ceazar Bucayon BARIAS, Manabu YAJIMA
  • ADJUSTABLE CLAMP FINGER DESIGN
    Publication number: 20240051089
    Abstract: Implementations of a clamp finger may include a first portion including at least one tip configured to clamp a substrate against an anvil during a bonding operation; and a second portion including a first opening therethrough configured to permit coupling of the second portion with a clamping bridge. The first portion may be slidably coupled with the second portion through a rail and the first portion may include an opening therethrough configured to receive a screw that fixedly couples the at least one tip of the first portion at a desired position relative to the second portion.
    Type: Application
    Filed: August 12, 2022
    Publication date: February 15, 2024
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Sen SUN, Kun FENG, Hu CHENG, Naima WANG